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Bild Teilenummer Hersteller Menge Lieferfrist Stückpreis Kaufen Beschreibung Series Operating Temperature Type Material Shape Height Length Width Plating Plating - Thickness Attachment Method
11-28FS-NI-16
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.11 X 0.28 NI 16--FOLDED SERIES
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Nickel Flash Adhesive
11-45CD-BD-16
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.11 X 0.45 CD BD 16--11-45CD-BD
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.110" (2.79mm) 16.000" (406.40mm) 0.450" (11.43mm) Unplated - Adhesive
11-45CT-BD-16
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.11 X 0.45 CT BD 16--11-45CT-BD
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.110" (2.79mm) 16.000" (406.40mm) 0.450" (11.43mm) Unplated - Adhesive
11-S-28FS-SN-16
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.11 X 0.28 SN 16--FOLDED SERIES
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Tin Flash Adhesive
11-S-28FSV23-NI-16
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.11 X 0.28 X 0.24 NI 16.0--FOLD
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Nickel Flash Adhesive
14-37FS-SN-16
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.14 X 0.36 BD SN 16--FOLDED SER
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.140" (3.56mm) 16.000" (406.40mm) 0.370" (9.40mm) Tin Flash Adhesive
14-S-37FSV30-SN-16
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.14 X 0.37 SN 16--FOLDED SERIES
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.140" (3.56mm) 16.000" (406.40mm) 0.370" (9.40mm) Tin Flash Adhesive
3-23UT-070-NI-16
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.03 X 0.275 X 070 NI 16--TWIST
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.030" (0.76mm) 16.000" (406.40mm) 0.230" (5.84mm) Nickel Flash Adhesive
6-34UT3-070-BD-16
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.07 X 0.38 X 070 BD 16--TWIST C
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.060" (1.52mm) 16.000" (406.40mm) 0.220" (5.59mm) Unplated - Adhesive
8100-9010-81
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
.032"TX4.50"W W/ADHESIVE--8100-9
- -62°C ~ 260°C Gasket Conductive Elastomer - - - - - - -
11-S-35DTS-SN-15
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.11 X 0.354 SN 15--11-S-35DTS-S
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.110" (2.79mm) 15.000" (381.00mm) 0.350" (8.89mm) Tin Flash Adhesive
6-34T-NI-24
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.07 X 0.34 NI 24--6-34T-NI-24--
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.070" (1.78mm) 24.000" (609.60mm) 0.340" (8.64mm) Nickel Flash Adhesive
6-34TV-NI-24
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.07 X 0.14 NI 24--TWIST RIGHT A
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.070" (1.78mm) 24.000" (609.60mm) 0.140" (3.56mm) Nickel Flash Adhesive
6-34UT-070-BD-16
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.07 X 0.22 X 070 BD 16--TWIST C
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.060" (1.52mm) 16.000" (406.40mm) 0.220" (5.59mm) Unplated - Adhesive
6-S-34T-SN-24
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.07 X 0.34 SN 24--6-S-34T-SN-24
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.060" (1.52mm) 24.000" (609.60mm) 0.340" (8.64mm) Tin Flash Adhesive
98097517
Laird Technologies EMI
Anfrage
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MOQ: 1  MPQ: 1
LS,STR,SNB,USFT,PSA
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7000-9020-72
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
.156" DIA ROUND ALL MESH--7000-9
- - Gasket - Round - - 0.156" (3.96mm) Tin - -
22-77RR-BD-16
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.23 X 0.77 BD 16--22-77RR-BD-16
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.220" (5.59mm) 16.000" (406.40mm) 0.770" (19.56mm) Unplated - Adhesive
4418AB51K08400
Laird Technologies EMI
Anfrage
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MOQ: 1  MPQ: 1
GK NICU NRS PU V0 REC
- - - - - - - - - - -
98095808
Laird Technologies EMI
Anfrage
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MOQ: 1  MPQ: 1
S3,STR,SNSAT,USFT,RIV
- 121°C Fingerstock Beryllium Copper - 0.110" (2.79mm) 15.000" (381.00mm) 0.350" (8.89mm) Tin 299.21μin (7.60μm) Adhesive