- Series：
-
- Operating Temperature：
-
- Shape：
-
- Length：
-
- Width：
-
- Plating：
-
- Plating - Thickness：
-
- Attachment Method：
-
- Ausgewählte Bedingungen:
Entdecken Sie 43 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
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Laird Technologies EMI |
527
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU ALLOY 11.43X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.450" (11.43mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
491
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU ALLOY 6.35X406.4MM
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 11.176X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.440" (11.18mm) | - | - | Clip | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 11.176X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.440" (11.18mm) | - | - | Clip | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTCK ULTRASFT 6.35X406.4MM
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 10.67X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.420" (10.67mm) | - | - | Clip | ||
|
|
Leader Tech Inc. |
93
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | - | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | - | |||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,BF,USFT
|
Clip-On | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.440" (11.18mm) | - | - | Clip | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,BF,USF,PSA
|
Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 0.262" (6.67mm) | 0.450" (11.43mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STRSNB,USFT
|
Clip-On | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.440" (11.18mm) | Tin | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL BF PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.250" (6.35mm) | Unplated | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,ZNC,USFT,PSA
|
Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 0.262" (6.67mm) | 0.450" (11.43mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,USFT,PSA
|
Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 0.262" (6.67mm) | 0.450" (11.43mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,USFT,PSA
|
Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 0.262" (6.67mm) | 0.450" (11.43mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.262" (6.67mm) | 0.450" (11.43mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,BF
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL SNB PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 25.000 (7.62m) | 0.250" (6.35mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,ZNC,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.250" (6.35mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.250" (6.35mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.250" (6.35mm) | Nickel | 299.21μin (7.60μm) | Adhesive |
