- Series：
-
- Operating Temperature：
-
- Material：
-
- Shape：
-
- Height：
-
- Width：
-
- Plating - Thickness：
-
- Attachment Method：
-
- Ausgewählte Bedingungen:
Entdecken Sie 18 -Produkte
 |
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Harwin Inc. |
42,000
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 4MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.157" (4.00mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
43,476
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 4MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.157" (4.00mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
43,476
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 4MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.157" (4.00mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
63,000
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 6MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.236" (6.00mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
64,160
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 6MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.236" (6.00mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
64,160
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 6MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.236" (6.00mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,500
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.209" (5.30mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,637
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.209" (5.30mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,637
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.209" (5.30mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
SMD CONTACT 2.0X4.0X5.5
|
- | - | - | - | - | - | 0.078" (2mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
1,044
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SMD CONTACT 2.0X4.0X5.5
|
- | - | - | - | - | - | 0.078" (2mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
SMD CONTACT 2.0X4.0X5.5
|
- | - | - | - | - | - | 0.078" (2mm) | - | - | - | ||
|
|
|
Leader Tech Inc. |
1,200
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SURFACE MOUNT GASKET
|
- | - | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.236" (6.00mm) | 0.295" (7.49mm) | - | - | - | ||
|
|
|
Leader Tech Inc. |
2,400
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SURFACE MOUNT GASKET
|
- | - | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.236" (6.00mm) | 0.295" (7.49mm) | - | - | - | ||
|
|
|
Leader Tech Inc. |
2,400
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SURFACE MOUNT GASKET
|
- | - | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.236" (6.00mm) | 0.295" (7.49mm) | - | - | - | ||
|
|
TE Connectivity AMP Connectors |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
ACCY SPRING SHIELD FINGER
|
- | - | Shield Finger | - | - | 0.079" (2.00mm) | 0.102" (2.60mm) | - | - | Solder | |||
|
|
TE Connectivity AMP Connectors |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
HIGH CURRENT SPRING FINGER
|
- | - | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.094" (2.40mm) | 0.067" (1.70mm) | Gold | 19.685μin (0.50μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
33,281
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
HIGH CURRENT SPRING FINGER
|
- | - | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.094" (2.40mm) | 0.067" (1.70mm) | Gold | 19.685μin (0.50μm) | Solder |
