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Bild Teilenummer Hersteller Menge Lieferfrist Stückpreis Kaufen Beschreibung Series Operating Temperature Type Material Shape Height Length Width Plating Plating - Thickness Attachment Method
11-78R2-BD-16
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.125 X 0.78 BD 16--11-78R2-BD-1
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.130" (3.30mm) 16.000" (406.40mm) 0.780" (19.81mm) Unplated - Adhesive
11-S-28FSV23-SN-16
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.11 X 0.28 X 0.24 SN 16.0--FOLD
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Tin Flash Adhesive
14-37FSV30-SN-16
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.14 X 0.37 SN 16--FOLDED SERIES
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.140" (3.56mm) 16.000" (406.40mm) 0.370" (9.40mm) Tin Flash Adhesive
97065608
Laird Technologies EMI
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MOQ: 1  MPQ: 1
PCLIP,STR,SNS,CLO
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97065617
Laird Technologies EMI
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MOQ: 1  MPQ: 1
PCLIP,STR,SNB,CLO
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97065619
Laird Technologies EMI
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MOQ: 1  MPQ: 1
PCLIP,STR,NIB,CLO
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6-30T-NI-24
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.07 X 0.30 NI 24--6-30T-NI-24--
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.060" (1.52mm) 24.000" (609.60mm) 0.300" (7.62mm) Nickel Flash Adhesive
6-34TV-SN-24
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.07 X 0.14 SN 24--TWIST RIGHT A
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.070" (1.78mm) 24.000" (609.60mm) 0.140" (3.56mm) Tin Flash Adhesive
6-34UT-040-BD-16
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.07 X 0.22 X 040 BD 16--TWIST C
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.060" (1.52mm) 16.000" (406.40mm) 0.220" (5.59mm) Unplated - Adhesive
11-90S-BD-16
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.12 X 0.90 BD 16--11-90S-BD-16-
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.110" (2.79mm) 16.000" (406.40mm) 0.900" (22.86mm) Unplated - Adhesive
25-78FS-BD-85.875-NTP
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.25 X 0.78 BD 85.875 NTP--FOLDE
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.250" (6.35mm) 7.16 (2.18m) 0.780" (19.81mm) Unplated - Adhesive
10-30C-045-BD-16
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.10 X 0.30 X 0.045 BD 16--10-30
TechMESH -55°C ~ 121°C Fingerstock Beryllium Copper - 0.100" (2.54mm) 16.000" (406.40mm) 0.300" (7.62mm) Unplated - Adhesive
10-30C-050-BD-16
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.10 X 0.30 X 050 BD 16--10-30C-
TechMESH -55°C ~ 121°C Fingerstock Beryllium Copper - 0.100" (2.54mm) 16.000" (406.40mm) 0.300" (7.62mm) Unplated - Adhesive
10-30C-065-BD-16
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.10 X 0.30 X 065 BD 16--10-30C-
TechMESH -55°C ~ 121°C Fingerstock Beryllium Copper - 0.100" (2.54mm) 16.000" (406.40mm) 0.300" (7.62mm) Unplated - Adhesive
10-30C-070-BD-16
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.10 X 0.30 X 070 BD 16--10-30C-
TechMESH -55°C ~ 121°C Fingerstock Beryllium Copper - 0.100" (2.54mm) 16.000" (406.40mm) 0.300" (7.62mm) Unplated - Adhesive
11-28FS-SN-16
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.11 X 0.28 SN 16--FOLDED SERIES
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Tin Flash Adhesive
11-32AH-SN-16
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.11 X 0.32 SN 16--11-32AH-SN-16
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.110" (2.79mm) 16.000" (406.40mm) 0.320" (8.13mm) Tin Flash Adhesive
11-35DT-SN-15
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.11 X 0.35 SN 15--11-35DT-SN-15
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.110" (2.79mm) 15.000" (381.00mm) 0.350" (8.89mm) Tin Flash Adhesive
11-37FSC-SN-16
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.11 X 0.375 SN 16--FOLDED SERIE
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.110" (2.79mm) 16.000" (406.40mm) 0.380" (9.65mm) Tin Flash Adhesive
9-78D-SN-16
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.09 X 0.78 SN 16--9-78D-SN-16--
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.090" (2.29mm) 16.000" (406.40mm) 0.780" (19.81mm) Tin Flash Adhesive