- Series：
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- Operating Temperature：
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- Shape：
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- Length：
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- Width：
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- Plating - Thickness：
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- Attachment Method：
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- Ausgewählte Bedingungen:
Entdecken Sie 53 -Produkte
 |
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Leader Tech Inc. |
139
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3 tage |
-
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MOQ: 1 MPQ: 1
|
FSG，.25"H X .375"W X 48"L
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- | - | Fabric Over Foam | - | D-Shape | 48.000" (121.90cm) | 0.375" (9.52mm) | - | - | - | ||
|
|
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Laird Technologies EMI |
405
|
3 tage |
-
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MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 24MMX406.4MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.375" (9.53mm) | 0.940" (23.88mm) | - | - | Hardware，Rivet，Solder | ||
|
|
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Laird Technologies EMI |
97
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 27.69MMX406.4MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 1.090" (27.69mm) | - | - | Hardware，Rivet，Solder | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
|
GASKET BECU 19.81X609.6MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.780" (19.81mm) | - | - | Adhesive | ||
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|
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
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Large Enclosure | 121°C | Fingerstock | Beryllium Copper | - | 25.000 (7.62m) | 1.090" (27.69mm) | - | - | Hardware，Rivet，Solder | ||
|
|
Leader Tech Inc. |
78
|
3 tage |
-
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MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
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- | - | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.550" (13.97mm) | Tin | - | Adhesive | |||
|
|
Leader Tech Inc. |
53
|
3 tage |
-
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MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
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- | - | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.550" (13.97mm) | - | - | Adhesive | |||
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|
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,SNB,RA
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- | 121°C | Fingerstock | Beryllium Copper | - | 12.000" (304.80mm) | 0.780" (19.81mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,NIB,RA
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- | 121°C | Fingerstock | Beryllium Copper | - | 12.000" (304.80mm) | 0.780" (19.81mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
CSTR COIL BF USF
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Large Enclosure | 121°C | Fingerstock | Beryllium Copper | - | 25.000 (7.60m) | 1.090" (27.69mm) | Unplated | - | Adhesive | ||
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|
|
Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,BF
|
- | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.780" (19.81mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNSAT,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.780" (19.81mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.780" (19.81mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,NIE,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.780" (19.81mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP COIL BF PSA
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All-Purpose | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.780" (19.81mm) | Unplated | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,CDY,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.780" (19.81mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNPB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.780" (19.81mm) | Lead，Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
.250"H X .375"W X 0.40"L--D SHAP
|
- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | D-Shape | 0.400" (10.16mm) | 0.375" (9.53mm) | - | - | - | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
.250"H X .600"W X 10"L--RECTANGU
|
- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Rectangular | 10.000" (254.00mm) | 0.600" (15.24mm) | - | - | - | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
.250"H X .500"W X 8"L--RECTANGUL
|
- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Rectangular | 8.000" (203.20mm) | 0.500" (12.70mm) | - | - | - |
