- Operating Temperature:
-
- Height:
-
- Width:
-
- Plating:
-
- Plating - Thickness:
-
- Attachment Method:
-
- Ausgewählte Bedingungen:
Entdecken Sie 76 -Produkte
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | ||
Laird Technologies EMI |
259
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 15.82X381MM
|
121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 0.620" (15.75mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
56
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 12.20X381MM
|
- | - | - | - | - | 0.480" (12.20mm) | - | - | - | ||||
Laird Technologies EMI |
74
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 11.43X381MM
|
121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 0.450" (11.43mm) | - | - | Rivet | ||||
Laird Technologies EMI |
94
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 15.82X381MM
|
- | - | - | - | - | 0.623" (15.82mm) | - | - | - | ||||
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 8.9X381MM
|
121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.350" (8.89mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 8.9X381MM
|
121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.350" (8.89mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 11.43X381MM
|
121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 0.450" (11.43mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 11.43X381MM
|
121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 0.450" (11.43mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 15.82X381MM
|
121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 0.620" (15.75mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 8.9X381MM
|
121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.350" (8.89mm) | - | - | Rivet | ||||
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 8.9X381MM
|
121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.350" (8.89mm) | - | - | Rivet | ||||
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 11.43X381MM
|
121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 0.450" (11.43mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 15.82X381MM
|
121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 0.620" (15.75mm) | - | - | Rivet | ||||
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 15.82X381MM
|
121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 0.620" (15.75mm) | Tin | 299.21μin (7.60μm) | Rivet | ||||
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET FABRIC/FOAM 3X381MM SQ
|
- | Fabric Over Foam | Polyurethane Foam,Nickel-Copper Polyester (NI/CU) | Rectangle | 0.118" (3.00mm) | 0.118" (3.00mm) | - | - | - | ||||
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU NRSG PU V0 DSH
|
- | Fabric Over Foam | - | D-Shape | 0.142" (3.60mm) | 0.252" (6.40mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET FABRIC/FOAM 6.35X381MM SQ
|
- | Fabric Over Foam | Polyurethane Foam,Nickel-Copper Polyester (NI/CU) | Square | 0.252" (6.40mm) | 0.252" (6.40mm) | - | - | - | ||||
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU PTAF TPE HB KN
|
- | Fabric Over Foam | - | Knife | 0.106" (2.70mm) | 0.445" (11.30mm) | - | - | - | ||||
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,BF
|
121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.350" (8.89mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,BF
|
121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 0.450" (11.43mm) | - | - | Adhesive |