- Material：
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- Shape：
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- Plating - Thickness：
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- Attachment Method：
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- Ausgewählte Bedingungen:
Entdecken Sie 5 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
|
GK NICU PTAFG PU V0 REC
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- | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 0.039" (1.00mm) | 0.118" (3.00mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
DCON,25P,SS
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121°C | Fingerstock | Stainless Steel | - | 0.025" (0.64mm) | 0.690" (17.53mm) | - | - | Slot | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
|
DCON,25P,BF
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121°C | Fingerstock | Beryllium Copper | - | 0.025" (0.64mm) | 0.360" (9.14mm) | - | - | Slot | ||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
DCON,25P,SNB
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121°C | Fingerstock | Beryllium Copper | - | 0.025" (0.64mm) | 0.690" (17.53mm) | Tin | 299.21μin (7.60μm) | Slot | ||
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|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
DCON,25P,BF
|
121°C | Fingerstock | Beryllium Copper | - | 0.025" (0.64mm) | 0.690" (17.53mm) | - | - | Slot |
