- Type:
-
- Material:
-
- Height:
-
- Width:
-
- Plating:
-
- Plating - Thickness:
-
- Attachment Method:
-
- Ausgewählte Bedingungen:
Entdecken Sie 7 -Produkte
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Operating Temperature | Type | Material | Height | Width | Plating | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Operating Temperature | Type | Material | Height | Width | Plating | Plating - Thickness | Attachment Method | ||
Laird Technologies EMI |
2,273
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
CARD GUI CLIPON BECU 2.03X9.53MM
|
121°C | Fingerstock | Beryllium Copper | 0.062" (1.57mm) | 0.084" (2.13mm) | - | - | Clip | ||||
Laird Technologies EMI |
6,601
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 2.03X9.53MM
|
- | Fingerstock | Beryllium Copper | 0.084" (2.13mm) | 0.256" (6.50mm) | Unplated | - | Clip | ||||
Laird Technologies EMI |
1,437
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
CARD GUI CLIPON BECU 3.05X9.53MM
|
- | - | - | - | 0.120" (3.05mm) | - | - | - | ||||
Laird Technologies EMI |
405
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 24MMX406.4MM
|
121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 0.940" (23.88mm) | - | - | Hardware,Rivet,Solder | ||||
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CGCLIP,NIB,CLO
|
121°C | Fingerstock | Beryllium Copper | 0.194" (4.93mm) | 0.084" (2.13mm) | Nickel | 299.21μin (7.60μm) | Clip | ||||
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CGCLIP,SNB,CLO
|
121°C | Fingerstock | Beryllium Copper | 0.194" (4.93mm) | 0.084" (2.13mm) | Tin | 299.21μin (7.60μm) | Clip | ||||
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CGCLIP,NIE,CLO
|
121°C | Fingerstock | Beryllium Copper | 0.194" (4.93mm) | 0.084" (2.13mm) | Nickel | 299.21μin (7.60μm) | Clip |