- Series：
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- Operating Temperature：
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- Type：
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- Material：
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- Shape：
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- Height：
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- Length：
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- Width：
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- Ausgewählte Bedingungen:
Entdecken Sie 2,625 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Attachment Method | |
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Unplated | Adhesive | ||
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|
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Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | Unplated | Adhesive | ||
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|
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Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
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Large Enclosure | 121°C | Fingerstock | Beryllium Copper | - | 0.250" (6.35mm) | 25.000 (7.62m) | 1.090" (27.69mm) | - | Hardware，Rivet，Solder | ||
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|
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Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Unplated | Adhesive | ||
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|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 12.7X609.6MM
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.500" (12.70mm) | - | Adhesive | ||
|
|
Leader Tech Inc. |
22,000
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SMS,TECH CLIP--PCB--SHIELD COVER
|
- | - | Shield Clip | Phosphor Bronze | - | 0.137" (3.48mm) | 0.310" (7.87mm) | 0.090" (2.28mm) | Tin | - | |||
|
|
Leader Tech Inc. |
23,160
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SMS,TECH CLIP--PCB--SHIELD COVER
|
- | - | Shield Clip | Phosphor Bronze | - | 0.137" (3.48mm) | 0.310" (7.87mm) | 0.090" (2.28mm) | Tin | - | |||
|
|
Leader Tech Inc. |
23,160
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SMS,TECH CLIP--PCB--SHIELD COVER
|
- | - | Shield Clip | Phosphor Bronze | - | 0.137" (3.48mm) | 0.310" (7.87mm) | 0.090" (2.28mm) | Tin | - | |||
|
|
TE Connectivity AMP Connectors |
16,000
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER 3525
|
- | - | Shield Finger | - | - | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | - | Solder | |||
|
|
TE Connectivity AMP Connectors |
16,671
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER 3525
|
- | - | Shield Finger | - | - | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | - | Solder | |||
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|
|
Laird Technologies EMI |
3,251
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Hourglass | 0.315" (8.00mm) | 0.276" (7.00mm) | 0.236" (6.00mm) | - | Solder | ||
|
|
|
Laird Technologies EMI |
3,820
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Hourglass | 0.315" (8.00mm) | 0.276" (7.00mm) | 0.236" (6.00mm) | - | Solder | ||
|
|
|
Laird Technologies EMI |
3,820
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Hourglass | 0.315" (8.00mm) | 0.276" (7.00mm) | 0.236" (6.00mm) | - | Solder | ||
|
|
|
Laird Technologies EMI |
1,200
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.394" (10.00mm) | 0.394" (10.00mm) | 0.394" (10.00mm) | - | Solder | ||
|
|
|
Laird Technologies EMI |
1,262
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.394" (10.00mm) | 0.394" (10.00mm) | 0.394" (10.00mm) | - | Solder | ||
|
|
|
Laird Technologies EMI |
1,262
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.394" (10.00mm) | 0.394" (10.00mm) | 0.394" (10.00mm) | - | Solder | ||
|
|
|
Leader Tech Inc. |
1,800
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SURFACE MOUNT GASKET
|
- | - | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.118" (3.00mm) | 0.079" (2.00mm) | 0.118" (3.00mm) | - | - | ||
|
|
|
Leader Tech Inc. |
3,595
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SURFACE MOUNT GASKET
|
- | - | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.118" (3.00mm) | 0.079" (2.00mm) | 0.118" (3.00mm) | - | - | ||
|
|
|
Leader Tech Inc. |
3,595
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SURFACE MOUNT GASKET
|
- | - | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.118" (3.00mm) | 0.079" (2.00mm) | 0.118" (3.00mm) | - | - | ||
|
|
|
Leader Tech Inc. |
1,800
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SURFACE MOUNT GASKET
|
- | - | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.118" (3.00mm) | 0.197" (5.00mm) | 0.157" (4.00mm) | - | - |
