- Series：
-
- Operating Temperature：
-
- Type：
-
- Material：
-
- Height：
-
- Length：
-
- Plating：
-
- Attachment Method：
-
- Ausgewählte Bedingungen:
Entdecken Sie 10 -Produkte
 |
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Height | Length | Plating | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Height | Length | Plating | Attachment Method | |
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|
Laird Technologies EMI |
97
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 27.69MMX406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 16.000" (406.40mm) | - | Hardware，Rivet，Solder | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
Large Enclosure | 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 25.000 (7.62m) | - | Hardware，Rivet，Solder | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL BF USF
|
Large Enclosure | 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 25.000 (7.60m) | Unplated | Adhesive | ||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 BD 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 24.000" (609.60mm) | Unplated | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP PCS SNSAT CTL
|
- | - | - | - | - | - | - | - | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 X 070 BD 16--25-109C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 16.000" (406.40mm) | Unplated | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 X 120 BD 16--25-109C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 16.000" (406.40mm) | Unplated | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 X 130 BD 16--25-109C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 16.000" (406.40mm) | Unplated | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 SU 300"--FOLDED SERI
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 25.00 (7.62m) | Unplated | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 BD 300"--FOLDED SERI
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 25.00 (7.62m) | Unplated | Adhesive |
