0C97043802

Beschreibung :
RFI EMI GROUNDING MATERIAL 25FT
Attachment Method :
Hardware,Rivet,Solder
Height :
0.250" (6.35mm)
Length :
25.000 (7.62m)
Material :
Beryllium Copper
Operating Temperature :
121°C
Plating :
-
Plating - Thickness :
-
Series :
Large Enclosure
Shape :
-
Type :
Fingerstock
Width :
1.090" (27.69mm)

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