Hersteller:
Series:
Operating Temperature:
Plating:
Attachment Method:
Entdecken Sie 6 -Produkte
Bild Teilenummer Hersteller Menge Lieferfrist Stückpreis Kaufen Beschreibung Series Operating Temperature Type Material Height Plating Attachment Method
77010317
Laird Technologies EMI
Anfrage
-
-
MOQ: 1  MPQ: 1
SLMT,2F,SNB
Slot Mount - - - - - -
6-34UT-040-BD-16
Leader Tech Inc.
Anfrage
-
-
MOQ: 1  MPQ: 1
0.07 X 0.22 X 040 BD 16--TWIST C
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.060" (1.52mm) Unplated Adhesive
6-34UT3-070-BD-16
Leader Tech Inc.
Anfrage
-
-
MOQ: 1  MPQ: 1
0.07 X 0.38 X 070 BD 16--TWIST C
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.060" (1.52mm) Unplated Adhesive
6-34UT-070-BD-16
Leader Tech Inc.
Anfrage
-
-
MOQ: 1  MPQ: 1
0.07 X 0.22 X 070 BD 16--TWIST C
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.060" (1.52mm) Unplated Adhesive
6-34UT3-070-DL-BD-16
Leader Tech Inc.
Anfrage
-
-
MOQ: 1  MPQ: 1
0.07 X 0.38 X 070 BD 16--TWIST C
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.060" (1.52mm) Unplated Adhesive
6-34UT-070-DL-BD-16
Leader Tech Inc.
Anfrage
-
-
MOQ: 1  MPQ: 1
0.07 X 0.22 X 070 BD 16--TWIST C
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.060" (1.52mm) Unplated Adhesive