- Series：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Core Processor：
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- Voltage - I/O：
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- Speed：
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- Number of Cores/Bus Width：
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- Co-Processors/DSP：
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- RAM Controllers：
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- Display & Interface Controllers：
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- Ethernet：
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- SATA：
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- USB：
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- Security Features：
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- Ausgewählte Bedingungen:
Entdecken Sie 6,346 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | |
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NXP USA Inc. |
415
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3 tage |
-
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MOQ: 1 MPQ: 1
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IC MPU MPC52XX 400MHZ 272BGA
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Tray | MPC52xx | 0°C ~ 70°C (TA) | 272-BBGA | 272-PBGA (27x27) | PowerPC e300 | 2.5V，3.3V | 400MHz | 1 Core，32-Bit | - | DDR，SDRAM | No | - | 10/100 Mbps (1) | - | USB 1.1 (2) | - | ||
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NXP USA Inc. |
471
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3 tage |
-
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MOQ: 1 MPQ: 1
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IC MPU M683XX 20MHZ 100LQFP
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Tray | M683xx | 0°C ~ 70°C (TA) | 100-LQFP | 100-LQFP (14x14) | M68000 | 5.0V | 20MHz | 1 Core，8/16-Bit | Communications; RISC CPM | DRAM | No | - | - | - | - | - | ||
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NXP USA Inc. |
495
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3 tage |
-
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MOQ: 1 MPQ: 1
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IC MPU MPC52XX 400MHZ 272BGA
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Tray | MPC52xx | -40°C ~ 85°C (TA) | 272-BBGA | 272-PBGA (27x27) | PowerPC e300 | 2.5V，3.3V | 400MHz | 1 Core，32-Bit | - | DDR，SDRAM | No | - | 10/100 Mbps (1) | - | USB 1.1 (2) | - | ||
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NXP USA Inc. |
420
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3 tage |
-
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MOQ: 1 MPQ: 1
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IC MPU I.MX6DL 1.0GHZ 624MAPBGA
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Tray | i.MX6DL | -40°C ~ 125°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1GHz | 2 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
936
|
3 tage |
-
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MOQ: 1 MPQ: 1
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IC MPU I.MX6D 800MHZ 624FCBGA
|
Tray | i.MX6D | -40°C ~ 105°C (TA) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 800MHz | 2 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
190
|
3 tage |
-
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MOQ: 1 MPQ: 1
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IC MPU M683XX 16MHZ 132QFP
|
Tray | M683xx | 0°C ~ 70°C (TA) | 132-BQFP Bumpered | 132-PQFP (24.13x24.13) | M68000 | 5.0V | 16MHz | 1 Core，8/16-Bit | Communications; RISC CPM | DRAM | No | - | - | - | - | - | ||
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Texas Instruments |
529
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3 tage |
-
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MOQ: 1 MPQ: 1
|
SITARA PROCESSOR
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Tray | Sitara | -40°C ~ 105°C (TJ) | 760-BFBGA，FCBGA | 760-FCBGA (23x23) | ARM® Cortex®-A15 | 1.8V，3.3V | 1.5GHz | 1 Core，32-Bit | Multimedia; GPU，IPU，VFP | DDR3，SRAM | Yes | HDMI | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 (1)，USB 3.0 (1) | - | ||
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NXP USA Inc. |
770
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3 tage |
-
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MOQ: 1 MPQ: 1
|
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
Tray | i.MX6Q | -20°C ~ 105°C (TJ) | 624-LFBGA，FCBGA | 624-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
395
|
3 tage |
-
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MOQ: 1 MPQ: 1
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IC MPU I.MX6Q 1.0GHZ 624FCBGA
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Tray | i.MX6Q | -20°C ~ 105°C (TJ) | 624-LFBGA，FCBGA | 624-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
888
|
3 tage |
-
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MOQ: 1 MPQ: 1
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IC MPU I.MX6D 1.0GHZ 624FCBGA
|
Tray | i.MX6D | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 2 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
592
|
3 tage |
-
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MOQ: 1 MPQ: 1
|
IC MPU I.MX6Q 800MHZ 624FCBGA
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Tray | i.MX6Q | -40°C ~ 105°C (TA) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 800MHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
734
|
3 tage |
-
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MOQ: 1 MPQ: 1
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IC MPU MPC82XX 400MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 400MHz | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | - | ||
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|
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NXP USA Inc. |
788
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
Tray | i.MX6Q | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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|
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NXP USA Inc. |
514
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
Tray | i.MX6Q | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
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NXP USA Inc. |
165
|
3 tage |
-
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MOQ: 1 MPQ: 1
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IC MPU I.MX6D ENHANCED 624FCBGA
|
Tray | i.MX6Q | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
169
|
3 tage |
-
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MOQ: 1 MPQ: 1
|
IC MPU I.MX6QP 1GHZ 624FCBGA
|
Tray | i.MX6QP | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 4 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3L，DDR3 | Yes | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
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NXP USA Inc. |
440
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3 tage |
-
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MOQ: 1 MPQ: 1
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IC MPU MPC82XX 266MHZ 516BGA
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Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 266MHz | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - | ||
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Renesas Electronics America |
60
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3 tage |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT ROMLESS 449FBGA
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Tray | - | -20°C ~ 75°C (TA) | 449-FBGA | 449-FBGA (21x21) | SH-4A | - | 400MHz | - | - | - | - | - | - | - | - | - | ||
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NXP USA Inc. |
72
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3 tage |
-
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MOQ: 1 MPQ: 1
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IC MPU M683XX 25MHZ 240FQFP
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Tray | M683xx | 0°C ~ 70°C (TA) | 240-BFQFP | 240-FQFP (32x32) | CPU32+ | 5.0V | 25MHz | 1 Core，32-Bit | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | - | - | ||
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NXP USA Inc. |
305
|
3 tage |
-
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MOQ: 1 MPQ: 1
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IC MPU MPC82XX 450MHZ 480TBGA
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Tray | MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | 450MHz | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - |
