- Series:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Core Processor:
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- Voltage - I/O:
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- Speed:
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- Number of Cores/Bus Width:
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- Co-Processors/DSP:
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- RAM Controllers:
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- Display & Interface Controllers:
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- Ethernet:
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- SATA:
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- USB:
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- Security Features:
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- Ausgewählte Bedingungen:
Entdecken Sie 6,346 -Produkte
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | ||
NXP USA Inc. |
415
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC52XX 400MHZ 272BGA
|
Tray | MPC52xx | 0°C ~ 70°C (TA) | 272-BBGA | 272-PBGA (27x27) | PowerPC e300 | 2.5V,3.3V | 400MHz | 1 Core,32-Bit | - | DDR,SDRAM | No | - | 10/100 Mbps (1) | - | USB 1.1 (2) | - | ||||
NXP USA Inc. |
471
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU M683XX 20MHZ 100LQFP
|
Tray | M683xx | 0°C ~ 70°C (TA) | 100-LQFP | 100-LQFP (14x14) | M68000 | 5.0V | 20MHz | 1 Core,8/16-Bit | Communications; RISC CPM | DRAM | No | - | - | - | - | - | ||||
NXP USA Inc. |
495
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC52XX 400MHZ 272BGA
|
Tray | MPC52xx | -40°C ~ 85°C (TA) | 272-BBGA | 272-PBGA (27x27) | PowerPC e300 | 2.5V,3.3V | 400MHz | 1 Core,32-Bit | - | DDR,SDRAM | No | - | 10/100 Mbps (1) | - | USB 1.1 (2) | - | ||||
NXP USA Inc. |
420
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tray | i.MX6DL | -40°C ~ 125°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1GHz | 2 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
936
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6D 800MHZ 624FCBGA
|
Tray | i.MX6D | -40°C ~ 105°C (TA) | 624-FBGA,FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 800MHz | 2 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
190
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU M683XX 16MHZ 132QFP
|
Tray | M683xx | 0°C ~ 70°C (TA) | 132-BQFP Bumpered | 132-PQFP (24.13x24.13) | M68000 | 5.0V | 16MHz | 1 Core,8/16-Bit | Communications; RISC CPM | DRAM | No | - | - | - | - | - | ||||
Texas Instruments |
529
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SITARA PROCESSOR
|
Tray | Sitara | -40°C ~ 105°C (TJ) | 760-BFBGA,FCBGA | 760-FCBGA (23x23) | ARM® Cortex®-A15 | 1.8V,3.3V | 1.5GHz | 1 Core,32-Bit | Multimedia; GPU,IPU,VFP | DDR3,SRAM | Yes | HDMI | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 (1),USB 3.0 (1) | - | ||||
NXP USA Inc. |
770
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
Tray | i.MX6Q | -20°C ~ 105°C (TJ) | 624-LFBGA,FCBGA | 624-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 4 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
395
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
Tray | i.MX6Q | -20°C ~ 105°C (TJ) | 624-LFBGA,FCBGA | 624-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 4 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
888
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6D 1.0GHZ 624FCBGA
|
Tray | i.MX6D | -40°C ~ 125°C (TJ) | 624-FBGA,FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 2 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
592
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6Q 800MHZ 624FCBGA
|
Tray | i.MX6Q | -40°C ~ 105°C (TA) | 624-FBGA,FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 800MHz | 4 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
734
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 400MHz | 1 Core,32-Bit | Communications; RISC CPM | DRAM,SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | - | ||||
NXP USA Inc. |
788
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
Tray | i.MX6Q | -40°C ~ 125°C (TJ) | 624-FBGA,FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 4 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
514
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
Tray | i.MX6Q | -40°C ~ 125°C (TJ) | 624-FBGA,FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 4 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
165
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6D ENHANCED 624FCBGA
|
Tray | i.MX6Q | -40°C ~ 125°C (TJ) | 624-FBGA,FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 4 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
169
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6QP 1GHZ 624FCBGA
|
Tray | i.MX6QP | -40°C ~ 125°C (TJ) | 624-FBGA,FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 4 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,DDR3L,DDR3 | Yes | HDMI,Keypad,LCD,LVDS,MIPI/DSI,Parallel | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3),USB 2.0 OTG + PHY (1) | ARM TZ,A-HAB,CAAM,CSU,SJC,SNVS | ||||
NXP USA Inc. |
440
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 266MHz | 1 Core,32-Bit | Communications; RISC CPM | DRAM,SDRAM | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - | ||||
Renesas Electronics America |
60
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 449FBGA
|
Tray | - | -20°C ~ 75°C (TA) | 449-FBGA | 449-FBGA (21x21) | SH-4A | - | 400MHz | - | - | - | - | - | - | - | - | - | ||||
NXP USA Inc. |
72
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU M683XX 25MHZ 240FQFP
|
Tray | M683xx | 0°C ~ 70°C (TA) | 240-BFQFP | 240-FQFP (32x32) | CPU32+ | 5.0V | 25MHz | 1 Core,32-Bit | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | - | - | ||||
NXP USA Inc. |
305
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | 450MHz | 1 Core,32-Bit | Communications; RISC CPM | DRAM,SDRAM | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - |