- Series:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Core Processor:
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- Voltage - I/O:
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- Speed:
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- Number of Cores/Bus Width:
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- Co-Processors/DSP:
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- RAM Controllers:
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- Display & Interface Controllers:
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- Ethernet:
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- SATA:
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- USB:
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- Security Features:
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- Ausgewählte Bedingungen:
Entdecken Sie 6,346 -Produkte
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | ||
Texas Instruments |
2,811
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU SITARA 800MHZ 324NFBGA
|
Tray | Sitara | -40°C ~ 105°C (TJ) | 324-LFBGA | 324-NFBGA(15x15) | ARM® Cortex®-A8 | 1.8V,3.3V | 800MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR,DDR2,DDR3,DDR3L | Yes | LCD,Touchscreen | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | Cryptography,Random Number Generator | ||||
NXP USA Inc. |
2,652
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 400MHZ 473MAPBGA
|
Tray | MPC83XX | 0°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | PowerPC e300c3 | 1.8V,2.5V,3.3V | 400MHz | 1 Core,32-Bit | - | DDR2 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 (1) | - | ||||
NXP USA Inc. |
990
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX27 400MHZ 404MAPBGA
|
Tray | i.MX27 | -20°C ~ 85°C (TA) | 404-LFBGA | 404-MAPBGA (17x17) | ARM926EJ-S | 2.0V,2.5V,2.7V,3.0V | 400MHz | 1 Core,32-Bit | Security; SAHARAH2 | DDR | Yes | Keypad,LCD | 10/100 Mbps (1) | - | USB 2.0 + PHY (3) | Cryptography,Random Number Generator,RTIC,Secure Fusebox,Secure Memory | ||||
NXP USA Inc. |
453
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 417MHZ 489BGA
|
Tray | MPC83XX | -40°C ~ 105°C (TA) | 489-LFBGA | 489-PBGA (19x19) | PowerPC e300c3 | 1.8V,3.3V | 417MHz | 1 Core,32-Bit | Communications; QUICC Engine | DDR2 | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - | ||||
NXP USA Inc. |
265
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 800MHZ 400MAPBGA
|
Tray | i.MX6SX | -40°C ~ 105°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A9,ARM® Cortex®-M4 | 1.8V,2.5V,2.8V,3.15V | 200MHz,800MHz | 2 Core,32-Bit | Multimedia; NEON® MPE | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1),USB 2.0 OTG + PHY (2) | A-HAB,ARM TZ,CAAM,CSU,SNVS,System JTAG,TVDECODE | ||||
NXP USA Inc. |
1,520
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 1GHZ 400MAPBGA
|
Tray | i.MX6SX | -20°C ~ 105°C (TJ) | 400-LFBGA | 400-MAPBGA (14x14) | ARM® Cortex®-A9,ARM® Cortex®-M4 | 1.8V,2.5V,2.8V,3.15V | 200MHz,1GHz | 2 Core,32-Bit | Multimedia; NEON® MPE | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1),USB 2.0 OTG + PHY (2) | A-HAB,ARM TZ,CAAM,CSU,SNVS,System JTAG,TVDECODE | ||||
NXP USA Inc. |
1,129
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
Tray | i.MX6S | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
230
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
Tray | i.MX6S | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
1,424
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 800MHZ 529MAPBGA
|
Tray | i.MX6SX | -40°C ~ 105°C (TA) | 529-LFBGA | 529-MAPBGA (19x19) | ARM® Cortex®-A9,ARM® Cortex®-M4 | 1.8V,2.5V,2.8V,3.15V | 200MHz,800MHz | 2 Core,32-Bit | Multimedia; NEON® MPE | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD,LVDS | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1),USB 2.0 OTG + PHY (2) | A-HAB,ARM TZ,CAAM,CSU,SNVS,System JTAG,TVDECODE | ||||
NXP USA Inc. |
564
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 800MHZ 529MAPBGA
|
Tray | i.MX6SX | -40°C ~ 125°C (TJ) | 529-LFBGA | 529-MAPBGA (19x19) | ARM® Cortex®-A9,ARM® Cortex®-M4 | 1.8V,2.5V,2.8V,3.15V | 200MHz,800MHz | 2 Core,32-Bit | Multimedia; NEON® MPE | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD,LVDS | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1),USB 2.0 OTG + PHY (2) | A-HAB,ARM TZ,CAAM,CSU,SNVS,System JTAG,TVDECODE | ||||
NXP USA Inc. |
1,173
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
Tray | i.MX6S | -20°C ~ 105°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
596
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 333MHZ 516BGA
|
Tray | MPC83XX | 0°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V,2.5V,3.3V | 333MHz | 1 Core,32-Bit | - | DDR,DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | - | ||||
NXP USA Inc. |
1,825
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 800MHZ 624MAPBGA
|
Tray | i.MX6S | -40°C ~ 105°C (TA) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 800MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
446
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 800MHZ 624MAPBGA
|
Tray | i.MX6S | -40°C ~ 125°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 800MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
Texas Instruments |
1,817
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU OMAP-35XX 600MHZ 515FCBGA
|
Tray | OMAP-35xx | 0°C ~ 90°C (TJ) | 515-VFBGA,FCBGA | 515-POP-FCBGA (12x12) | ARM® Cortex®-A8 | 1.8V,3.0V | 600MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR | No | LCD | - | - | USB 1.x (3),USB 2.0 (1) | - | ||||
NXP USA Inc. |
911
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tray | i.MX6DL | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 2 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
1,680
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX53 1.0GHZ 529TEBGA-2
|
Tray | i.MX53 | -20°C ~ 85°C (TC) | 529-FBGA | 529-FBGA (19x19) | ARM® Cortex®-A8 | 1.3V,1.8V,2.775V,3.3V | 1.0GHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,DDR2,DDR3 | Yes | Keypad,LCD | 10/100 Mbps (1) | SATA 1.5Gbps (1) | USB 2.0 (2),USB 2.0 + PHY (2) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
292
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tray | i.MX6DL | -20°C ~ 105°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | 2 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
499
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 800MHZ 624MAPBGA
|
Tray | i.MX6DL | -40°C ~ 105°C (TA) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 800MHz | 2 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
133
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 333MHZ 516BGA
|
Tray | MPC83XX | -40°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V,2.5V,3.3V | 333MHz | 1 Core,32-Bit | Security; SEC 2.2 | DDR,DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | Cryptography |