- Series：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Core Processor：
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- Voltage - I/O：
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- Number of Cores/Bus Width：
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- Co-Processors/DSP：
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- RAM Controllers：
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- Display & Interface Controllers：
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- Ethernet：
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- SATA：
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- Security Features：
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- Ausgewählte Bedingungen:
Entdecken Sie 120 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | |
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NXP USA Inc. |
596
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3 tage |
-
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MOQ: 1 MPQ: 1
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IC MPU MPC83XX 333MHZ 516BGA
|
MPC83XX | 0°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | - | DDR，DDR2 | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | - | ||
|
|
|
NXP USA Inc. |
133
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 333MHZ 516BGA
|
MPC83XX | -40°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | Security; SEC 2.2 | DDR，DDR2 | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | Cryptography | ||
|
|
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NXP USA Inc. |
79
|
3 tage |
-
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MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 333MHZ 480TBGA
|
MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - | ||
|
|
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NXP USA Inc. |
75
|
3 tage |
-
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MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 333MHZ 352TBGA
|
MPC82xx | -40°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 3.3V | 1 Core，32-Bit | - | SDRAM | - | - | - | - | - | ||
|
|
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NXP USA Inc. |
139
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 333MHZ 352TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 3.3V | 1 Core，32-Bit | - | SDRAM | - | - | - | - | - | ||
|
|
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NXP USA Inc. |
29
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 333MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - | ||
|
|
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NXP USA Inc. |
252
|
3 tage |
-
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MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 333MHZ 369BGA
|
MPC83XX | -40°C ~ 105°C (TA) | 369-LFBGA | 369-PBGA (19x19) | PowerPC e300c3 | 1.8V，3.3V | 1 Core，32-Bit | Communications; QUICC Engine | DDR2 | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - | ||
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|
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NXP USA Inc. |
84
|
3 tage |
-
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MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 333MHZ 473MAPBGA
|
MPC83XX | 0°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | - | DDR2 | - | 10/100/1000 Mbps (3) | - | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
84
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 333MHZ 489BGA
|
MPC83XX | 0°C ~ 105°C (TA) | 489-LFBGA | 489-PBGA (19x19) | PowerPC e300c3 | 1.8V，3.3V | 1 Core，32-Bit | Communications; QUICC Engine | DDR2 | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - | ||
|
|
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NXP USA Inc. |
40
|
3 tage |
-
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MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 333MHZ 516BGA
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MPC83XX | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC e300c2 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | Communications; QUICC Engine | DDR，DDR2 | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - | ||
|
|
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NXP USA Inc. |
30
|
3 tage |
-
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MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 333MHZ 516BGA
|
MPC83XX | 0°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | Security; SEC 2.2 | DDR，DDR2 | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | Cryptography | ||
|
|
|
NXP USA Inc. |
40
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 333MHZ 516BGA
|
MPC83XX | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC e300c2 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | Communications; QUICC Engine，Security; SEC 2.2 | DDR，DDR2 | - | 10/100 Mbps (3) | - | USB 2.0 (1) | Cryptography | ||
|
|
|
NXP USA Inc. |
40
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 333MHZ 516BGA
|
MPC83XX | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC e300c2 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | Communications; QUICC Engine，Security; SEC 2.2 | DDR，DDR2 | - | 10/100 Mbps (3) | - | USB 2.0 (1) | Cryptography | ||
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NXP USA Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 333MHZ 516BGA
|
MPC83XX | -40°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | - | DDR，DDR2 | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | - | ||
|
|
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NXP USA Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 333MHZ 516BGA
|
MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - | ||
|
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STMicroelectronics |
Anfrage
|
- |
-
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MOQ: 756 MPQ: 1
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IC MPU SPEAR 333MHZ 289LFBGA
|
SPEAr | -40°C ~ 85°C (TC) | 289-LFBGA | 289-LFBGA | ARM926EJ-S | 3.3V | 1 Core，32-Bit | Security; C3 | LPDDR，DDR2 | Keyboard，LCD，Touchscreen | 10/100 Mbps (1) | - | USB 2.0 + PHY (3) | Cryptography | ||
|
|
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STMicroelectronics |
Anfrage
|
- |
-
|
MOQ: 756 MPQ: 1
|
IC MPU SPEAR 333MHZ 289LFBGA
|
SPEAr | -40°C ~ 85°C (TC) | 289-LFBGA | 289-LFBGA | ARM926EJ-S | 3.3V | 1 Core，32-Bit | Security; C3 | LPDDR，DDR2 | - | 10/100 Mbps (5) | - | USB 2.0 + PHY (3) | Cryptography | ||
|
|
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STMicroelectronics |
Anfrage
|
- |
-
|
MOQ: 360 MPQ: 1
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IC MPU SPEAR 333MHZ 420BGA
|
SPEAr | -40°C ~ 85°C (TC) | 420-FBGA | 420-PBGA | ARM926EJ-S | 3.3V | 2 Core，32-Bit | - | DDR，DDR2 | LCD，Touchscreen | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (3) | - | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 333MHZ 473MAPBGA
|
MPC83XX | -40°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 1 Core，32-Bit | - | DDR2 | - | 10/100/1000 Mbps (3) | - | USB 2.0 (1) | - | ||
|
|
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NXP USA Inc. |
Anfrage
|
- |
-
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MOQ: 420 MPQ: 1
|
IC MPU MPC83XX 333MHZ 369BGA
|
MPC83XX | 0°C ~ 105°C (TA) | 369-LFBGA | 369-PBGA (19x19) | PowerPC e300c3 | 1.8V，3.3V | 1 Core，32-Bit | Communications; QUICC Engine | DDR2 | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - |
