- Series：
-
- Operating Temperature：
-
- Package / Case：
-
- Supplier Device Package：
-
- Core Processor：
-
- Voltage - I/O：
-
- Speed：
-
- Number of Cores/Bus Width：
-
- Co-Processors/DSP：
-
- RAM Controllers：
-
- Display & Interface Controllers：
-
- USB：
-
- Ausgewählte Bedingungen:
Entdecken Sie 217 -Produkte
 |
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | USB | Security Features | |
|
|
|
NXP USA Inc. |
820
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6UL 289BGA
|
Tray | i.MX6UL | -40°C ~ 105°C (TJ) | 289-LFBGA | 289-MAPBGA (14x14) | ARM® Cortex®-A7 | 1.2V，1.35V，1.5V，1.8V，2.5V，2.8V，3.3V | 528MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3，DDR3L | No | LCD，LVDS | USB 2.0 + PHY (2) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
734
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 400MHz | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
1,080
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 133MHZ 256BGA
|
Tray | MPC8xx | -40°C ~ 100°C (TA) | 256-BBGA | 256-PBGA (23x23) | MPC8xx | 3.3V | 133MHz | 1 Core，32-Bit | Communications; CPM | DRAM | No | - | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
122
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 266MHz | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
102
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 266MHz | 1 Core，32-Bit | Communications; RISC CPM，Security; SEC | DRAM，SDRAM | No | - | USB 2.0 (1) | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
101
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 400MHz | 1 Core，32-Bit | Communications; RISC CPM，Security; SEC | DRAM，SDRAM | No | - | USB 2.0 (1) | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
223
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
I.MX 32-BIT MPU ARM CORTEX-A7 C
|
Tray | i.MX6 | 0°C ~ 95°C (TJ) | 272-LFBGA | 272-MAPBGA (9x9) | ARM® Cortex®-A7 | 1.8V，2.8V，3.3V | 528MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DDR3L | No | Electrophoretic，LCD | USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
152
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
I.MX6ULL ROM PERF ENHAN
|
Tray | i.MX6 | 0°C ~ 95°C (TJ) | 289-LFBGA | 289-MAPBGA (14x14) | ARM® Cortex®-A7 | 1.8V，2.8V，3.3V | 900MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DDR3L | No | Electrophoretic，LCD | USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
144
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MC6UL 528MHZ 289BGA
|
Tray | i.MX6UL | 0°C ~ 95°C (TJ) | 289-LFBGA | 289-MAPBGA (14x14) | ARM® Cortex®-A7 | 1.2V，1.35V，1.5V，1.8V，2.5V，2.8V，3.3V | 528MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3，DDR3L | No | LCD，LVDS | USB 2.0 + PHY (2) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
122
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MC6UL 528MHZ 289BGA
|
Tray | i.MX6UL | 0°C ~ 95°C (TJ) | 289-LFBGA | 289-MAPBGA (14x14) | ARM® Cortex®-A7 | 1.2V，1.35V，1.5V，1.8V，2.5V，2.8V，3.3V | 528MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3，DDR3L | No | LCD，LVDS | USB 2.0 + PHY (2) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
166
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MC6UL 696MHZ 289BGA
|
Tray | i.MX6UL | -40°C ~ 125°C (TJ) | 289-LFBGA | 289-MAPBGA (14x14) | ARM® Cortex®-A7 | 1.2V，1.35V，1.5V，1.8V，2.5V，2.8V，3.3V | 696MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3，DDR3L | No | LCD，LVDS | USB 2.0 + PHY (2) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
128
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 364MAPBGA
|
Tray | Vybrid，VF5xx | -40°C ~ 85°C (TA) | 364-LFBGA | 364-LFBGA (17x17) | ARM® Cortex®-A5 | 3.3V | 500MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | USB 2.0 OTG + PHY (1) | - | ||
|
|
|
NXP USA Inc. |
163
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MC6UL 528MHZ 272BGA
|
Tray | i.MX6UL | 0°C ~ 95°C (TJ) | 272-LFBGA | 272-MAPBGA (9x9) | ARM® Cortex®-A7 | 1.2V，1.35V，1.5V，1.8V，2.5V，2.8V，3.3V | 528MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3，DDR3L | No | LCD，LVDS | USB 2.0 + PHY (2) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
891
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MC6UL 528MHZ 289BGA
|
Tray | i.MX6UL | -40°C ~ 125°C (TJ) | 289-LFBGA | 289-MAPBGA (14x14) | ARM® Cortex®-A7 | 1.2V，1.35V，1.5V，1.8V，2.5V，2.8V，3.3V | 528MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3，DDR3L | No | LCD，LVDS | USB 2.0 + PHY (2) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
40
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 66MHZ 256BGA
|
Tray | MPC8xx | 0°C ~ 95°C (TA) | 256-BBGA | 256-PBGA (23x23) | MPC8xx | 3.3V | 66MHz | 1 Core，32-Bit | Communications; CPM | DRAM | No | - | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
103
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 133MHZ 256BGA
|
Tray | MPC8xx | 0°C ~ 95°C (TA) | 256-BBGA | 256-PBGA (23x23) | MPC8xx | 3.3V | 133MHz | 1 Core，32-Bit | Communications; CPM | DRAM | No | - | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
74
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 400MHz | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
74
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 400MHz | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
87
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MC6UL 528MHZ 289BGA
|
Tray | i.MX6UL | -40°C ~ 125°C (TJ) | 289-LFBGA | 289-MAPBGA (14x14) | ARM® Cortex®-A7 | 1.2V，1.35V，1.5V，1.8V，2.5V，2.8V，3.3V | 528MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3，DDR3L | No | LCD，LVDS | USB 2.0 + PHY (2) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
40
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 176LQFP
|
Tray | Vybrid，VF3xx | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) | ARM® Cortex®-A5 | 3.3V | 266MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | USB 2.0 OTG + PHY (1) | - |
