Entdecken Sie 6 -Produkte
Bild Teilenummer Hersteller Menge Lieferfrist Stückpreis Kaufen Beschreibung Length Plating Plating - Thickness Attachment Method
0C97043802
Laird Technologies EMI
Anfrage
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MOQ: 1  MPQ: 1
RFI EMI GROUNDING MATERIAL 25FT
25.000 (7.62m) - - Hardware,Rivet,Solder
0C98043802
Laird Technologies EMI
Anfrage
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MOQ: 1  MPQ: 1
CSTR COIL BF USF
25.000 (7.60m) Unplated - Adhesive
0C97043817
Laird Technologies EMI
Anfrage
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MOQ: 1  MPQ: 1
CSTR COIL SNB
25.000 (7.60m) Tin 299.21μin (7.60μm) Hardware,Rivet,Solder
0C97043818
Laird Technologies EMI
Anfrage
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MOQ: 1  MPQ: 1
CSTR COIL NIE
25.000 (7.60m) Nickel 299.21μin (7.60μm) Hardware,Rivet,Solder
0C97043819
Laird Technologies EMI
Anfrage
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MOQ: 1  MPQ: 1
CSTR COIL NIB
25.000 (7.60m) Nickel 299.21μin (7.60μm) Hardware,Rivet,Solder
0C97043816
Laird Technologies EMI
Anfrage
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MOQ: 1  MPQ: 1
CSTR COIL ZNY
25.000 (7.62m) Zinc + Yellow Chromate 299.21μin (7.60μm) Hardware,Rivet,Solder