- Series：
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- Operating Temperature：
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- Material：
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- Height：
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- Width：
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- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Ausgewählte Bedingungen:
Entdecken Sie 422 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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GASKET BECU 9.65X406.4MM
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.120" (3.05mm) | 0.380" (9.65mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 15.24X406.4MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.280" (7.11mm) | 0.600" (15.24mm) | - | - | Clip | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
|
GASKET BECU 6.6X406.4MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.260" (6.60mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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GASKET BECU 7.11X406.4MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.055" (1.40mm) | 0.280" (7.11mm) | - | - | Adhesive | ||
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|
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 7X406.4MM
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Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.275" (6.99mm) | - | - | Clip | ||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 7X406.4MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.275" (6.99mm) | - | - | Clip | ||
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Laird Technologies EMI |
1
|
3 tage |
-
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MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 9.65X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.270" (6.86mm) | 0.380" (9.65mm) | - | - | Clip | ||
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|
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 7X406.4MM
|
- | - | - | - | - | - | 0.276" (7.00mm) | - | - | - | ||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
GASKET BECU 9.65X406.4MM
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.120" (3.05mm) | 0.380" (9.65mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
GASKET BECU 7.11X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.280" (7.11mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 15.24X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.210" (5.33mm) | 0.600" (15.24mm) | - | - | Clip | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 15.24X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.210" (5.33mm) | 0.600" (15.24mm) | - | - | Clip | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 10.67X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 0.420" (10.67mm) | - | - | Clip | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 15.24X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.280" (7.11mm) | 0.600" (15.24mm) | - | - | Clip | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 15.24X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.280" (7.11mm) | 0.600" (15.24mm) | - | - | Clip | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 8.1X406.4MM
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No Snag | 121°C | Fingerstock | Beryllium Copper | - | 0.090" (2.29mm) | 0.320" (8.13mm) | - | - | Adhesive | ||
|
|
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | ||
|
|
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.280" (7.11mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.280" (7.11mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
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Leader Tech Inc. |
453
|
3 tage |
-
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MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
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- | - | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.320" (8.13mm) | - | - | Adhesive |
