- Series：
-
- Operating Temperature：
-
- Shape：
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- Width：
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- Plating - Thickness：
-
- Attachment Method：
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- Ausgewählte Bedingungen:
Entdecken Sie 17 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Shape | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Shape | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
|
FINGRSTK BECU ALY 11.176X406.4MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.440" (11.78mm) | - | - | Clip | ||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
GASKET BECU 9.65X406.4MM
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.380" (9.65mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
GASKET BECU 9.65X406.4MM
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.380" (9.65mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
CLO,STR,TLN,SNB,USFT
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Clip-On | 121°C | Fingerstock | Beryllium Copper | - | 0.440" (11.18mm) | Tin | 299.21μin (7.60μm) | Clip | ||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
NOSG COIL BF PSA
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.380" (9.65mm) | Unplated | - | Adhesive | ||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
NOSG,STR,ZNC,PSA
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.380" (9.65mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
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|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.380" (9.65mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
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Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
.120"H X .155"W X 16.00"L--RECTA
|
- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Rectangular | 0.155" (3.94mm) | - | - | - | |||
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Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
0.12 X 0.75 SN 16 NTP--12-75RS-S
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.750" (19.05mm) | Tin | Flash | Adhesive | |||
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|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL SNB PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.380" (9.65mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,BF,USF,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.380" (9.65mm) | - | - | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,USF,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.380" (9.65mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,USF,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.380" (9.65mm) | Nickel | 299.21μin (7.60μm) | Adhesive | |||
|
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Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.12 X 0.60 BD 16--12-60LPAH-BD-
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.600" (15.24mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.12 X 0.75 BD 16--12-75RS-BD-16
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.750" (19.05mm) | Unplated | - | Adhesive | |||
|
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Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.12 X 0.60 SN 16--12-60LPAH-SN-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.600" (15.24mm) | Tin | Flash | Adhesive | |||
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|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.12 X 0.75 SN 16--12-75RS-SN-16
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.750" (19.05mm) | Tin | Flash | Adhesive |
