- Series：
-
- Operating Temperature：
-
- Type：
-
- Material：
-
- Height：
-
- Plating：
-
- Attachment Method：
-
- Ausgewählte Bedingungen:
Entdecken Sie 7 -Produkte
 |
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Height | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Height | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
SLMT,2F,SNB
|
Slot Mount | - | - | - | - | - | - | - | ||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X 0.22 X 040 BD 16--TWIST C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.060" (1.52mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X 0.38 X 070 BD 16--TWIST C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.060" (1.52mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X 0.22 X 070 BD 16--TWIST C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.060" (1.52mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X 0.38 X 070 BD 16--TWIST C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.060" (1.52mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X 0.22 X 070 BD 16--TWIST C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.060" (1.52mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X 0.22 X 070 SN 16--TWIST C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.060" (1.52mm) | Tin | Flash | Adhesive |
