- Series：
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- Operating Temperature：
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- Material：
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- Height：
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- Width：
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- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Ausgewählte Bedingungen:
Entdecken Sie 422 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
|
0.14 X 0.51 BD 16--FOLDED SERIES
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 0.510" (12.95mm) | Unplated | - | Adhesive | |||
|
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Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
0.13 X 0.37 BD 16--13-37AH-BD-16
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.130" (3.30mm) | 0.370" (9.40mm) | Unplated | - | Adhesive | |||
|
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Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.28 BD 16--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
0.11 X 0.28 X 0.24 BD 16.0--FOLD
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.14 X 0.37 BD 16--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 0.370" (9.40mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.03 X 0.15 X 040 BD 16--TWIST C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.230" (5.84mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.28 X 0.49 SN16--28-49U-SN-16--
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.280" (7.11mm) | 0.490" (12.44mm) | Tin | Flash | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
NOSG COIL SNB PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 0.510" (12.95mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
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|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.375 BD 16--FOLDED SERIE
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.380" (9.65mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.09 X 0.78 BD 16--9-78D-A-BD-16
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.090" (2.29mm) | 0.780" (19.81mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.09 X 0.78 BD 16--9-78D-BD-16--
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.090" (2.29mm) | 0.780" (19.81mm) | Unplated | - | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,USFT,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 0.370" (9.40mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,NIB,USFT,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 0.370" (9.40mm) | Nickel | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,BF,USFT
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 0.250" (6.35mm) | - | - | - | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.13 X 0.37 BD 16--13-S-37AH-BD-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.130" (3.30mm) | 0.370" (9.40mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.28 BD 16--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.14 X 0.37 BD 16--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 0.370" (9.40mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.10 X 0.30 CT BD 16--10-30CT-BD
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.300" (7.62mm) | 0.100" (2.54mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.32 BD 16--11-S-32RH-BD-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.320" (8.13mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.375 BD 16--FOLDED SERIE
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.370" (9.40mm) | Unplated | - | Adhesive |
