- Series：
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- Operating Temperature：
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- Material：
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- Height：
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- Width：
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- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Ausgewählte Bedingungen:
Entdecken Sie 422 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,BF,USF,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.120" (3.05mm) | 0.380" (9.65mm) | - | - | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.22 X 0.60 BD 16--22-S-60AF-BD-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 0.600" (15.24mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.28 X 0.23 NI 16--FOLDED
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.280" (7.11mm) | Nickel | Flash | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL ZNY PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 0.250" (6.35mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL NIB PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 0.250" (6.35mm) | Nickel | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,BF,USF,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.280" (7.11mm) | - | - | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.32 NI 16--11-32AF-NI-16
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.320" (8.13mm) | Nickel | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.32 NI 16--11-32RH-NI-16
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.320" (8.13mm) | Nickel | Flash | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,BF,USFT,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 0.510" (12.95mm) | - | - | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.28 NI 16 NTP--FOLDED SE
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.280" (7.11mm) | Nickel | Flash | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,BF,USF,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 0.370" (9.40mm) | - | - | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,USF,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 0.250" (6.35mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.22 X 0.60 BD 16--22-60RH-BD-16
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 0.600" (15.24mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.067 X 0.177 BD 16--7-19PCI-BD-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 1.800" (45.72mm) | Unplated | - | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,USF,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.120" (3.05mm) | 0.380" (9.65mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,USF,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.120" (3.05mm) | 0.380" (9.65mm) | Nickel | 299.21μin (7.60μm) | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.28 X 0.23 BD 16--FOLDED
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.03 X 0.15 X 070 BD 16--TWIST C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.230" (5.84mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.03 X 0.15 X 070 SN 16--TWIST C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.230" (5.84mm) | Tin | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.23 X 0.60 SN 16--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 0.600" (15.24mm) | Tin | Flash | Adhesive |
