- Series：
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- Operating Temperature：
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- Material：
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- Height：
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- Width：
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- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Ausgewählte Bedingungen:
Entdecken Sie 422 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
|
GASKET BECU 8.1MMX7.6M
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Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.320" (8.13mm) | Tin | 299.21μin (7.60μm) | Slot | |||
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|
Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
GASKET ULTRASOFT 8.1MMX7.6M
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Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.320" (8.13mm) | Tin | 299.21μin (7.60μm) | Slot | |||
|
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Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET ULTRASOFT 8.1MMX7.6M
|
Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.320" (8.13mm) | Nickel | 299.21μin (7.60μm) | Slot | |||
|
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
|
0.03 X 0.23 SN 16--3-23T-SN-16--
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.230" (5.84mm) | Tin | Flash | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
SLMT,STR,SNB,USFT
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.100" (2.54mm) | 0.325" (8.26mm) | Tin | 299.21μin (7.60μm) | Slot | |||
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Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
0.12 X 0.75 SN 16 NTP--12-75RS-S
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.120" (3.05mm) | 0.750" (19.05mm) | Tin | Flash | Adhesive | |||
|
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Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
0.03 X 0.15 X 040 BD 16--TWIST C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.230" (5.84mm) | Unplated | - | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP COIL BF USFT PSA
|
All-Purpose | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | |||
|
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
AP COIL NIB PSA
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All-Purpose | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 0.370" (9.40mm) | Nickel | 299.21μin (7.60μm) | Adhesive | |||
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Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
0.13 X 0.37 ST 16.0--13-S-37AH-S
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.130" (3.30mm) | 0.370" (9.40mm) | Tin | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.28 BD 16--11-28RH-BD-16
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.32 BD 16--11-32AF-BD-16
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.320" (8.13mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.32 BD 16--11-32RH-BD-16
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.320" (8.13mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.28 BD 16--11-S-28RH-BD-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.32 BD 16--11-S-32AF-BD-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.320" (8.13mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.13 X 0.37 BD 16--13-37RH-BD-16
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.130" (3.30mm) | 0.370" (9.40mm) | Unplated | - | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL SNB PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.120" (3.05mm) | 0.380" (9.65mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.13 X 0.37 BD 16--13-S-37RH-BD-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.130" (3.30mm) | 0.370" (9.40mm) | Unplated | - | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL BF USF PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 0.250" (6.35mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.32 SN 16--11-32RH-SN-16
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.320" (8.13mm) | Tin | Flash | Adhesive |
