- Series：
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- Operating Temperature：
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- Material：
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- Height：
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- Width：
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- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Ausgewählte Bedingungen:
Entdecken Sie 422 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,SNSAT,RA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.260" (6.60mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,RA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.260" (6.60mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.120" (3.05mm) | 0.380" (9.65mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,ZNC,RA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 0.370" (9.40mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,RA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 0.370" (9.40mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,NID,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.280" (7.11mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,ZNC,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.280" (7.11mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,ZNY,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.280" (7.11mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,NIE,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.280" (7.11mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,NIB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.280" (7.11mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 0.510" (12.95mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 0.510" (12.95mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNSAT,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 0.370" (9.40mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 0.370" (9.40mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,NIB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 0.370" (9.40mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.055" (1.40mm) | 0.280" (7.11mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SU,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.280" (7.11mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR,STR,NID,USFT,CLO
|
Clip-On | 121°C | Fingerstock | Beryllium Copper | - | 0.280" (7.11mm) | 0.330" (8.38mm) | Nickel | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,TLN,ZNY
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.280" (7.11mm) | 0.600" (15.24mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,TLN,SNB
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.280" (7.11mm) | 0.600" (15.24mm) | Tin | 299.21μin (7.60μm) | Clip |
