- Operating Temperature:
-
- Plating:
-
- Attachment Method:
-
- Ausgewählte Bedingungen:
Entdecken Sie 8 -Produkte
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Operating Temperature | Width | Plating | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Operating Temperature | Width | Plating | Plating - Thickness | Attachment Method | ||
Laird Technologies EMI |
97
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 27.69MMX406.4MM
|
121°C | 1.090" (27.69mm) | - | - | Hardware,Rivet,Solder | ||||
Leader Tech Inc. |
78
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | 0.550" (13.97mm) | Tin | - | Adhesive | ||||
Leader Tech Inc. |
53
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | 0.550" (13.97mm) | - | - | Adhesive | ||||
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 X 070 BD 16--25-109C
|
-55°C ~ 121°C | 1.090" (27.69mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 X 120 BD 16--25-109C
|
-55°C ~ 121°C | 1.090" (27.69mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 X 130 BD 16--25-109C
|
-55°C ~ 121°C | 1.090" (27.69mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 X 120 NI 16--25-109C
|
-55°C ~ 121°C | 1.090" (27.69mm) | Nickel | Flash | Adhesive | ||||
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 X 130 SN 16--25-109C
|
-55°C ~ 121°C | 1.090" (27.69mm) | Tin | Flash | Adhesive |