- Series：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Core Processor：
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- Voltage - I/O：
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- Speed：
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- Number of Cores/Bus Width：
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- Co-Processors/DSP：
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- RAM Controllers：
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- Display & Interface Controllers：
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- Ethernet：
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- USB：
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- Ausgewählte Bedingungen:
Entdecken Sie 4,039 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | |
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NXP USA Inc. |
52
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3 tage |
-
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MOQ: 1 MPQ: 1
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IC MPU Q OR IQ 800MHZ 689TEBGA
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Tray | QorIQ P1 | -40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | PowerPC e500v2 | - | 800MHz | 1 Core，32-Bit | - | DDR2，DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | ||
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NXP USA Inc. |
18
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3 tage |
-
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MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
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Tray | QorIQ P1 | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | PowerPC e500v2 | 2.5V，3.3V | 800MHz | 2 Core，32-Bit | - | DDR2，DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | ||
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|
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NXP USA Inc. |
28
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3 tage |
-
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MOQ: 1 MPQ: 1
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IC MPU MPC82XX 300MHZ 352TBGA
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Tray | MPC82xx | 0°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 3.3V | 300MHz | 1 Core，32-Bit | - | SDRAM | No | - | - | - | - | ||
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NXP USA Inc. |
22
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3 tage |
-
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MOQ: 1 MPQ: 1
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IC MPU M683XX 25MHZ 240FQFP
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Tray | M683xx | -40°C ~ 85°C (TA) | 240-BFQFP | 240-FQFP (32x32) | CPU32+ | 5.0V | 25MHz | 1 Core，32-Bit | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | - | ||
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NXP USA Inc. |
25
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3 tage |
-
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MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 100MHZ 357BGA
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Tray | MPC8xx | -40°C ~ 100°C (TA) | 357-BBGA | 357-PBGA (25x25) | MPC8xx | 3.3V | 100MHz | 1 Core，32-Bit | Communications; CPM | DRAM | No | - | 10 Mbps (4)，10/100 Mbps (1) | - | - | ||
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|
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NXP USA Inc. |
19
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3 tage |
-
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MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | 450MHz | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | ||
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Renesas Electronics America |
85
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3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 176LFBGA
|
Tray | RZ/A1LC | -40°C ~ 85°C (TA) | 176-LFBGA | 176-LFBGA (8x8) | ARM® Cortex®-A9 | 1.2V，3.3V | 400MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | SDRAM，SRAM | Yes | VDC | 10/100 Mbps | - | USB 2.0 (2) | ||
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Renesas Electronics America |
75
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 176BGA
|
Tray | RZ/A1LU | -40°C ~ 85°C (TA) | 176-LFBGA | 176-LFBGA (8x8) | ARM® Cortex®-A9 | 1.2V，3.3V | 400MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | SDRAM，SRAM | Yes | VDC | 10/100 Mbps (1)，100 Mbps (1) | - | USB 2.0 (2) | ||
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Renesas Electronics America |
58
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3 tage |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 176QFP
|
Tray | RZ/A1LU | -40°C ~ 85°C (TA) | 176-LQFP | 176-LFQFP (24x24) | ARM® Cortex®-A9 | 1.2V，3.3V | 400MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | SDRAM，SRAM | Yes | VDC | 10/100 Mbps (1)，100 Mbps (1) | - | USB 2.0 (2) | ||
|
|
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Renesas Electronics America |
48
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 208LFQFP
|
Tray | RZ/A1LU | -40°C ~ 85°C (TA) | 208-LQFP | 208-LFQFP (28x28) | ARM® Cortex®-A9 | 1.2V，3.3V | 400MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | SDRAM，SRAM | Yes | VDC | 10/100 Mbps (1)，100 Mbps (1) | - | USB 2.0 (2) | ||
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Renesas Electronics America |
18
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 208LFQFP
|
Tray | RZ/A1L | -40°C ~ 85°C (TA) | 208-LQFP | 208-LFQFP (28x28) | ARM® Cortex®-A9 | 1.2V，3.3V | 400MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | SDRAM，SRAM | Yes | VDC | 10/100 Mbps | - | USB 2.0 (2) | ||
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|
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Renesas Electronics America |
50
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 256LFBGA
|
Tray | RZ/A1M | -40°C ~ 85°C (TA) | 256-LFBGA | 256-LFBGA (11x11) | ARM® Cortex®-A9 | 1.2V，3.3V | 400MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | SDRAM，SRAM | Yes | DVD，VDC | 10/100 Mbps (1)，100 Mbps (1) | - | USB 2.0 (2) | ||
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|
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Renesas Electronics America |
48
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 256LQFP
|
Tray | RZ/A1M | -40°C ~ 85°C (TA) | 256-LQFP | 256-LQFP (28x28) | ARM® Cortex®-A9 | 1.2V，3.3V | 400MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | SDRAM，SRAM | Yes | DVD，VDC | 10/100 Mbps (1)，100 Mbps (1) | - | USB 2.0 (2) | ||
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|
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Renesas Electronics America |
50
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 324FBGA
|
Tray | RZ/A1M | -40°C ~ 85°C (TA) | 324-BGA | 324-FBGA (19x19) | ARM® Cortex®-A9 | 1.2V，3.3V | 400MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | SDRAM，SRAM | Yes | DVD，VDC | 10/100 Mbps (1)，100 Mbps (1) | - | USB 2.0 (2) | ||
|
|
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NXP USA Inc. |
9
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 266MHZ 620BGA
|
Tray | MPC83XX | 0°C ~ 105°C (TA) | 620-BBGA Exposed Pad | 620-PBGA (29x29) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 266MHz | 1 Core，32-Bit | - | DDR，DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | ||
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|
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NXP USA Inc. |
21
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 200MHZ 357BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 357-BBGA | 357-PBGA (25x25) | PowerPC 603e | 3.3V | 200MHz | 1 Core，32-Bit | - | SDRAM | No | - | - | - | - | ||
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|
|
NXP USA Inc. |
62
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU M683XX 16MHZ 100LQFP
|
Tray | M683xx | 0°C ~ 70°C (TA) | 100-LQFP | 100-LQFP (14x14) | M68000 | 3.3V | 16MHz | 1 Core，8/16-Bit | Communications; RISC CPM | DRAM | No | - | - | - | - | ||
|
|
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NXP USA Inc. |
34
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | QorIQ P1 | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | PowerPC e500v2 | - | 800MHz | 1 Core，32-Bit | - | DDR2，DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | ||
|
|
|
NXP USA Inc. |
79
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 400MHZ 672TBGA
|
Tray | MPC83XX | -40°C ~ 105°C (TA) | 672-LBGA | 672-TBGA (35x35) | PowerPC e300 | 2.5V，3.3V | 400MHz | 1 Core，32-Bit | - | DDR | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | ||
|
|
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NXP USA Inc. |
5
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 100MHZ 357BGA
|
Tray | MPC8xx | -40°C ~ 100°C (TA) | 357-BBGA | 357-PBGA (25x25) | MPC8xx | 3.3V | 100MHz | 1 Core，32-Bit | Communications; CPM | DRAM | No | - | 10 Mbps (4)，10/100 Mbps (1) | - | - |
