- Series:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Core Processor:
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- Voltage - I/O:
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- Number of Cores/Bus Width:
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- Co-Processors/DSP:
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- RAM Controllers:
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- Ausgewählte Bedingungen:
Entdecken Sie 5 -Produkte
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | ||
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 24 MPQ: 1
|
IC MPU MPC82XX 250MHZ 352TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 3.3V | 1 Core,32-Bit | - | DRAM,SDRAM | ||||
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC82XX 250MHZ 352TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 3.3V | 1 Core,32-Bit | - | DRAM,SDRAM | ||||
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 24 MPQ: 1
|
IC MPU MPC82XX 250MHZ 352TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 3.3V | 1 Core,32-Bit | - | DRAM,SDRAM | ||||
IDT,Integrated Device Technology Inc |
Anfrage
|
- |
-
|
MOQ: 24 MPQ: 1
|
IC MPU MIPS-I 250MHZ 128QFP
|
- | 0°C ~ 85°C (TC) | 128-BQFP Exposed Pad | 128-PQFP (28x28) | MIPS-I | 2.5V,3.3V | 1 Core,64-Bit | System Control; CP0 | SDRAM | ||||
IDT,Integrated Device Technology Inc |
Anfrage
|
- |
-
|
MOQ: 24 MPQ: 1
|
IC MPU MIPS-I 250MHZ 208QFP
|
- | 0°C ~ 85°C (TC) | 208-BFQFP Exposed Pad | 208-PQFP (28x28) | MIPS-I | 2.5V,3.3V | 1 Core,64-Bit | System Control; CP0 | SDRAM |