- Operating Temperature：
-
- Number of Cores/Bus Width：
-
- Co-Processors/DSP：
-
- RAM Controllers：
-
- Ausgewählte Bedingungen:
Entdecken Sie 17 -Produkte
 |
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Operating Temperature | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Operating Temperature | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | |
|
|
|
NXP USA Inc. |
60
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
0°C ~ 125°C (TA) | 1 Core，32-Bit | - | DDR3 | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
0°C ~ 125°C (TA) | 1 Core，32-Bit | - | DDR3 | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
-40°C ~ 125°C (TA) | 1 Core，32-Bit | - | DDR3 | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
0°C ~ 125°C (TA) | 2 Core，32-Bit | - | DDR3 | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
-40°C ~ 125°C (TA) | 2 Core，32-Bit | - | DDR3 | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
0°C ~ 125°C (TA) | 2 Core，32-Bit | Communications; QUICC Engine | DDR2，DDR3 | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
-40°C ~ 125°C (TA) | 1 Core，32-Bit | Communications; QUICC Engine | DDR2，DDR3 | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
-40°C ~ 125°C (TA) | 1 Core，32-Bit | - | DDR3 | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 83 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
0°C ~ 125°C (TA) | 1 Core，32-Bit | Communications; QUICC Engine | DDR2，DDR3 | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 77 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
0°C ~ 125°C (TA) | 1 Core，32-Bit | Communications; QUICC Engine | DDR2，DDR3 | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 72 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
-40°C ~ 125°C (TA) | 1 Core，32-Bit | Communications; QUICC Engine | DDR2，DDR3 | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
-40°C ~ 125°C (TA) | 1 Core，32-Bit | Communications; QUICC Engine | DDR2，DDR3 | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
0°C ~ 125°C (TA) | 2 Core，32-Bit | - | DDR3 | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
-40°C ~ 125°C (TA) | 2 Core，32-Bit | - | DDR3 | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
0°C ~ 125°C (TA) | 2 Core，32-Bit | Communications; QUICC Engine | DDR2，DDR3 | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
-40°C ~ 125°C (TA) | 2 Core，32-Bit | Communications; QUICC Engine | DDR2，DDR3 | ||
|
|
|
NXP USA Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
-40°C ~ 125°C (TA) | 2 Core，32-Bit | Communications; QUICC Engine | DDR2，DDR3 |
