- Series：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Core Processor：
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- Voltage - I/O：
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- Speed：
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- Number of Cores/Bus Width：
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- Co-Processors/DSP：
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- RAM Controllers：
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- Display & Interface Controllers：
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- Ethernet：
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- USB：
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- Ausgewählte Bedingungen:
Entdecken Sie 4,039 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | |
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Texas Instruments |
49
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3 tage |
-
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MOQ: 1 MPQ: 1
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IC MPU INTEL486 SX 25MHZ 160QFP
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Tray | - | 0°C ~ 70°C (TA) | 160-BFQFP | 160-PQFP (28x28) | Intel486 SX | 3.3V，5.0V | 25MHz | 1 Core，32-Bit | - | DRAM | No | LCD | - | - | - | ||
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Texas Instruments |
79
|
3 tage |
-
|
MOQ: 1 MPQ: 1
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IC MPU OMAP-59XX 150MHZ 289BGA
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Tray | OMAP-59xx | -40°C ~ 85°C (TC) | 289-BGA | 289-BGA (19x19) | ARM9TDMI | 1.8V，2.75V，3.3V | 150MHz | 1 Core，32-Bit | Signal Processing; C55x，System Control; CP15 | SDRAM | No | Keypad，LCD | - | - | USB 2.0 (2) | ||
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Renesas Electronics America |
5
|
3 tage |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT ROMLESS 449FBGA
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Tray | - | -40°C ~ 85°C (TA) | 449-FBGA | 449-FBGA (21x21) | SH-4A | - | 400MHz | - | - | - | - | - | - | - | - | ||
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NXP USA Inc. |
20
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.2GHZ 689TEBGA
|
Tray | QorIQ P2 | -40°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | PowerPC e500v2 | - | 1.2GHz | 1 Core，32-Bit | - | DDR2，DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | ||
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|
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NXP USA Inc. |
3
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC SOC 64BIT 24X 1.67GHZ 1932BGA
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Tray | QorIQ T4 | 0°C ~ 105°C (TA) | 1932-BBGA，FCBGA | 1932-FCPBGA (45x45) | PowerPC e6500 | - | 1.8GHz | 12 Core，64-Bit | - | DDR3，DDR3L | No | - | 1 Gbps (16)，10 Gbps (4) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | ||
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|
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Renesas Electronics America |
29
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 256LQFP
|
Tray | RZ/A1M | -40°C ~ 85°C (TA) | 256-LQFP | 256-LQFP (28x28) | ARM® Cortex®-A9 | 1.2V，3.3V | 400MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | SDRAM，SRAM | Yes | DVD，VDC | 10/100 Mbps (1)，100 Mbps (1) | - | USB 2.0 (2) | ||
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|
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Renesas Electronics America |
43
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 324FBGA
|
Tray | RZ/A1M | -40°C ~ 85°C (TA) | 324-BGA | 324-FBGA (19x19) | ARM® Cortex®-A9 | 1.2V，3.3V | 400MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | SDRAM，SRAM | Yes | DVD，VDC | 10/100 Mbps (1)，100 Mbps (1) | - | USB 2.0 (2) | ||
|
|
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NXP USA Inc. |
40
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 66MHZ 256BGA
|
Tray | MPC8xx | 0°C ~ 95°C (TA) | 256-BBGA | 256-PBGA (23x23) | MPC8xx | 3.3V | 66MHz | 1 Core，32-Bit | Communications; CPM | DRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | ||
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|
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NXP USA Inc. |
103
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 133MHZ 256BGA
|
Tray | MPC8xx | 0°C ~ 95°C (TA) | 256-BBGA | 256-PBGA (23x23) | MPC8xx | 3.3V | 133MHz | 1 Core，32-Bit | Communications; CPM | DRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | ||
|
|
|
Renesas Electronics America |
50
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 256LFBGA
|
Tray | RZ/A1H | -40°C ~ 85°C (TA) | 256-LFBGA | 256-LFBGA (11x11) | ARM® Cortex®-A9 | 1.2V，3.3V | 400MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | SDRAM，SRAM | Yes | DVD，VDC | 10/100 Mbps (1)，100 Mbps (1) | - | USB 2.0 (2) | ||
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|
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NXP USA Inc. |
44
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 266MHZ 620BGA
|
Tray | MPC83XX | -40°C ~ 105°C (TA) | 620-BBGA Exposed Pad | 620-PBGA (29x29) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 266MHz | 1 Core，32-Bit | - | DDR，DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | ||
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|
|
NXP USA Inc. |
84
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 425TEBGA
|
Tray | QorIQ P1 | 0°C ~ 105°C (TA) | 425-FBGA | 425-TEPBGA I (19x19) | PowerPC e500v2 | - | 800MHz | 1 Core，32-Bit | - | DDR3，DDR3L | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | ||
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|
|
NXP USA Inc. |
72
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 400MHZ 620BGA
|
Tray | MPC83XX | -40°C ~ 105°C (TA) | 620-BBGA Exposed Pad | 620-PBGA (29x29) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 400MHz | 1 Core，32-Bit | - | DDR，DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | ||
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|
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NXP USA Inc. |
72
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 400MHZ 620BGA
|
Tray | MPC83XX | -40°C ~ 105°C (TA) | 620-BBGA Exposed Pad | 620-PBGA (29x29) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 400MHz | 1 Core，32-Bit | - | DDR，DDR2 | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | ||
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|
|
Texas Instruments |
90
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU OMAP-35XX 600MHZ 423FCBGA
|
Tray | OMAP-35xx | 0°C ~ 90°C (TJ) | 423-LFBGA，FCBGA | 423-FCBGA (16x16) | ARM® Cortex®-A8 | 1.8V，3.0V | 600MHz | 1 Core，32-Bit | Signal Processing; C64x+，Multimedia; NEON® SIMD | LPDDR | Yes | LCD | - | - | USB 1.x (3)，USB 2.0 (1) | ||
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|
|
Texas Instruments |
21
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU OMAP-35XX 600MHZ 515FCBGA
|
Tray | OMAP-35xx | 0°C ~ 90°C (TJ) | 515-VFBGA，FCBGA | 515-POP-FCBGA (12x12) | ARM® Cortex®-A8 | 1.8V，3.0V | 600MHz | 1 Core，32-Bit | Signal Processing; C64x+，Multimedia; NEON® SIMD | LPDDR | Yes | LCD | - | - | USB 1.x (3)，USB 2.0 (1) | ||
|
|
|
NXP USA Inc. |
38
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | QorIQ P1 | -40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | PowerPC e500v2 | - | 800MHz | 1 Core，32-Bit | - | DDR2，DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | ||
|
|
|
NXP USA Inc. |
62
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU M683XX 20MHZ 132QFP
|
Tray | M683xx | 0°C ~ 70°C (TA) | 132-BQFP Bumpered | 132-PQFP (24.13x24.13) | M68000 | 5.0V | 20MHz | 1 Core，8/16-Bit | Communications; RISC CPM | DRAM | No | - | - | - | - | ||
|
|
|
NXP USA Inc. |
74
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 400MHz | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | ||
|
|
|
NXP USA Inc. |
74
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 400MHz | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) |
