- Series:
-
- Operating Temperature:
-
- Package / Case:
-
- Supplier Device Package:
-
- Core Processor:
-
- Voltage - I/O:
-
- Speed:
-
- Number of Cores/Bus Width:
-
- Co-Processors/DSP:
-
- RAM Controllers:
-
- Display & Interface Controllers:
-
- Ethernet:
-
- USB:
-
- Ausgewählte Bedingungen:
Entdecken Sie 4,039 -Produkte
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | ||
NXP USA Inc. |
30
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 533MHZ 672TBGA
|
Tray | MPC83XX | -40°C ~ 105°C (TA) | 672-LBGA | 672-TBGA (35x35) | PowerPC e300 | 1.8V,2.5V,3.3V | 533MHz | 1 Core,32-Bit | - | DDR,DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | ||||
NXP USA Inc. |
36
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC85XX 800MHZ 783FCBGA
|
Tray | MPC85xx | 0°C ~ 105°C (TA) | 783-BBGA,FCBGA | 783-FCPBGA (29x29) | PowerPC e500 | 1.8V,2.5V,3.3V | 800MHz | 1 Core,32-Bit | Signal Processing; SPE | DDR,DDR2,SDRAM | No | - | 10/100/1000 Mbps (4) | - | - | ||||
Texas Instruments |
43
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SOC MPU KEYSTONE 11
|
Tray | Sitara | -40°C ~ 100°C (TC) | 1089-BFBGA,FCBGA | 1089-FCBGA (27x27) | ARM® Cortex®-A15 | 1.35V,1.5V,1.8V,3.3V | 1.4GHz | 4 Core,32-Bit | Network | DDR3,SRAM | No | - | 1GBE (8),10GBE (2) | - | USB 3.0 (2) | ||||
NXP USA Inc. |
27
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.2GHZ 689TEBGA
|
Tray | QorIQ P2 | -40°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | PowerPC e500v2 | - | 1.2GHz | 2 Core,32-Bit | - | DDR2,DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | ||||
NXP USA Inc. |
124
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC85XX 1.333GHZ 783BGA
|
Tray | MPC85xx | 0°C ~ 105°C (TA) | 783-BBGA,FCBGA | 783-FCPBGA (29x29) | PowerPC e500 | 1.8V,2.5V,3.3V | 1.333GHz | 1 Core,32-Bit | Signal Processing; SPE | DDR,DDR2,SDRAM | No | - | 10/100/1000 Mbps (4) | - | - | ||||
NXP USA Inc. |
27
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC85XX 1.333GHZ 783BGA
|
Tray | MPC85xx | -40°C ~ 105°C (TA) | 783-BBGA,FCBGA | 783-FCPBGA (29x29) | PowerPC e500 | 1.8V,2.5V,3.3V | 1.333GHz | 1 Core,32-Bit | Signal Processing; SPE | DDR,DDR2,SDRAM | No | - | 10/100/1000 Mbps (4) | - | - | ||||
NXP USA Inc. |
36
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC85XX 1.5GHZ 783FCBGA
|
Tray | MPC85xx | 0°C ~ 105°C (TA) | 783-BBGA,FCBGA | 783-FCPBGA (29x29) | PowerPC e500 | 1.8V,2.5V,3.3V | 1.5GHz | 1 Core,32-Bit | Signal Processing; SPE | DDR,DDR2,SDRAM | No | - | 10/100/1000 Mbps (4) | - | - | ||||
NXP USA Inc. |
252
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 333MHZ 369BGA
|
Tray | MPC83XX | -40°C ~ 105°C (TA) | 369-LFBGA | 369-PBGA (19x19) | PowerPC e300c3 | 1.8V,3.3V | 333MHz | 1 Core,32-Bit | Communications; QUICC Engine | DDR2 | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | ||||
NXP USA Inc. |
359
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 66MHZ 256BGA
|
Tray | MPC8xx | -40°C ~ 100°C (TA) | 256-BBGA | 256-PBGA (23x23) | MPC8xx | 3.3V | 66MHz | 1 Core,32-Bit | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | - | ||||
NXP USA Inc. |
150
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC83XX 267MHZ 516BGA
|
Tray | MPC83XX | -40°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V,2.5V,3.3V | 267MHz | 1 Core,32-Bit | - | DDR,DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | ||||
NXP USA Inc. |
1,376
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 357BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 357-BBGA | 357-PBGA (25x25) | PowerPC 603e | 3.3V | 266MHz | 1 Core,32-Bit | - | SDRAM | No | - | - | - | - | ||||
NXP USA Inc. |
265
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 352TBGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 3.3V | 266MHz | 1 Core,32-Bit | - | SDRAM | No | - | - | - | - | ||||
NXP USA Inc. |
124
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 133MHZ 357BGA
|
Tray | MPC8xx | 0°C ~ 95°C (TA) | 357-BBGA | 357-PBGA (25x25) | MPC8xx | 3.3V | 133MHz | 1 Core,32-Bit | Communications; CPM | DRAM | No | - | 10 Mbps (4),10/100 Mbps (1) | - | - | ||||
NXP USA Inc. |
45
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 350MHZ 352TBGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 3.3V | 350MHz | 1 Core,32-Bit | - | SDRAM | No | - | - | - | - | ||||
NXP USA Inc. |
28
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.2GHZ 689TEBGA
|
Tray | QorIQ P2 | -40°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | PowerPC e500v2 | - | 1.2GHz | 1 Core,32-Bit | - | DDR2,DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | ||||
NXP USA Inc. |
59
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.2GHZ 689TEBGA
|
Tray | QorIQ P2 | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | PowerPC e500v2 | - | 1.2GHz | 2 Core,32-Bit | - | DDR2,DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | ||||
NXP USA Inc. |
29
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.2GHZ 780FCBGA
|
Tray | QorIQ P2 | 0°C ~ 105°C (TA) | 780-BFBGA,FCBGA | 780-FCPBGA (23x23) | PowerPC e500mc | 1.0V,1.35V,1.5V,1.8V,2.5V,3.3V | 1.2GHz | 4 Core,32-Bit | - | DDR3,DDR3L | No | - | 10/100/1000 Mbps (5) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | ||||
NXP USA Inc. |
26
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 480TBGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | 266MHz | 1 Core,32-Bit | Communications; RISC CPM | DRAM,SDRAM | No | - | 10/100 Mbps (3) | - | - | ||||
NXP USA Inc. |
207
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC85XX 833MHZ 783FCBGA
|
Tray | MPC85xx | 0°C ~ 105°C (TA) | 784-BBGA,FCBGA | 783-FCPBGA (29x29) | PowerPC e500 | 2.5V,3.3V | 833MHz | 1 Core,32-Bit | Communications; CPM | DDR,SDRAM | No | - | 10/100/1000 Mbps (2) | - | - | ||||
Renesas Electronics America |
68
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 208LQFP
|
Tray | RZ/A1L | -40°C ~ 85°C (TA) | 208-LQFP | 208-LQFP (28x28) | ARM® Cortex®-A9 | 1.2V,3.3V | 400MHz | 1 Core,32-Bit | Multimedia; NEON® MPE | SDRAM,SRAM | Yes | VDC | 10/100 Mbps | - | USB 2.0 (2) |