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- Shape：
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- Length：
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- Diameter：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Ausgewählte Bedingungen:
Entdecken Sie 429 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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-
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MOQ: 1 MPQ: 1
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BGA HEAT SINK
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Top Mount | Aluminum | Square, Fins | 0.985" (25.02mm) | 0.985" (25.02mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.390" (9.91mm) | - | 5.30°C/W @ 200 LFM | 10.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | - | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | - | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 5.00°C/W @ 400 LFM | 13.60°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Aluminum | Rectangular, Fins | 1.774" (45.06mm) | 1.378" (35.00mm) | - | Bolt On and PC Pin | TO-220 | 0.512" (13.00mm) | 3.0W @ 40°C | 4.00°C/W @ 400 LFM | 10.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 W/KOOL CLIP BLK
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Board Level, Vertical | Aluminum | Rectangular, Fins | 2.000" (50.80mm) | 1.380" (35.05mm) | - | Clip and Board Locks | TO-220 | 0.480" (12.19mm) | 6.0W @ 60°C | 3.00°C/W @ 500 LFM | - | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | - | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | - | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 6.00°C/W @ 300 LFM | 13.60°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Aluminum | Rectangular, Fins | 0.980" (24.89mm) | 0.942" (23.93mm) | - | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 6.00°C/W @ 400 LFM | 17.90°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Aluminum | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | - | Clip and PC Pin | TO-220 | 0.500" (12.70mm) | 2.0W @ 40°C | 8.00°C/W @ 500 LFM | 18.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Copper | Rectangular, Fins | 0.795" (20.19mm) | 0.915" (23.24mm) | - | Clip and PC Pin | Multiwatt, SIP | 0.380" (9.65mm) | 1.0W @ 30°C | 6.00°C/W @ 600 LFM | 16.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | - | - | - | - | - | - | - | - | - | - | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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-
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MOQ: 1 MPQ: 1
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HEAT SINK
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- | - | - | - | - | - | - | - | - | - | - | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Aluminum | Cylindrical | - | - | 0.318" (8.07mm) ID, 0.500" (12.70mm) OD | Press Fit | TO-5 | 0.250" (6.35mm) | 1.0W @ 60°C | 35.00°C/W @ 200 LFM | 60.00°C/W | Red Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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-
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MOQ: 1 MPQ: 1
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HEAT SINK
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- | - | - | - | - | - | - | - | - | - | - | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Aluminum | Rectangular | 1.000" (25.40mm) | 0.750" (19.05mm) | - | Clip | TO-220 | 0.350" (8.89mm) | 1.0W @ 30°C | 16.00°C/W @ 200 LFM | 26.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Aluminum | Square, Fins | 1.750" (44.45mm) | 0.490" (12.44mm) | - | Bolt On and Board Mounts | TO-218, TO-247 | 1.750" (44.45mm) | 4.0W @ 30°C | 1.50°C/W @ 400 LFM | 6.30°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Aluminum | Rectangular, Fins | 1.000" (25.40mm) | 0.640" (16.26mm) | - | Bolt On and PC Pin | TO-220 | 0.640" (16.26mm) | 4.0W @ 70°C | 4.00°C/W @ 500 LFM | 17.40°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Aluminum | Rectangular, Fins | 2.500" (63.50mm) | 1.650" (41.91mm) | - | Bolt On and PC Pin | TO-220 | 1.000" (25.40mm) | 4.0W @ 20°C | 1.50°C/W @ 400 LFM | 2.70°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Aluminum | Cylindrical | - | - | 0.317" (8.05mm) ID, 0.375" (9.52mm) OD | Press Fit | TO-5 | 0.400" (10.16mm) | 1.0W @ 70°C | 45.00°C/W @ 200 LFM | 90.00°C/W | Hard Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Aluminum | Rectangular, Fins | 2.000" (50.80mm) | 1.650" (41.91mm) | - | Clip and PC Pin | TO-220 | 1.000" (25.40mm) | 6.0W @ 30°C | 1.00°C/W @ 800 LFM | 4.50°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 CLIP-ON W/TABS
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Board Level, Vertical | Aluminum | Rectangular, Fins | 1.220" (30.99mm) | 1.000" (25.40mm) | - | Clip and Board Locks | Multiwatt, SIP | 0.500" (12.70mm) | 2.0W @ 30°C | 5.00°C/W @ 200 LFM | 11.50°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Aluminum | Cylindrical | - | - | 0.318" (8.07mm) ID, 0.500" (12.70mm) OD | Press Fit | TO-5 | 0.375" (9.52mm) | 1.8W @ 90°C | 30.00°C/W @ 200 LFM | 57.00°C/W | Red Anodized |
