335214B00032G

Beschreibung :
BGA HEAT SINK
Attachment Method :
Thermal Tape, Adhesive (Included)
Diameter :
-
Height Off Base (Height of Fin) :
0.390" (9.91mm)
Length :
0.985" (25.02mm)
Material :
Aluminum
Material Finish :
Black Anodized
Package Cooled :
BGA
Power Dissipation @ Temperature Rise :
-
Series :
-
Shape :
Square, Fins
Thermal Resistance @ Forced Air Flow :
5.30°C/W @ 200 LFM
Thermal Resistance @ Natural :
10.00°C/W
Type :
Top Mount
Width :
0.985" (25.02mm)

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