6038DG

Beschreibung :
BOARD LEVEL HEAT SINK
Attachment Method :
Clip and PC Pin
Diameter :
-
Height Off Base (Height of Fin) :
0.500" (12.70mm)
Length :
1.180" (29.97mm)
Material :
Aluminum
Material Finish :
Tin
Package Cooled :
TO-220
Power Dissipation @ Temperature Rise :
2.0W @ 40°C
Series :
-
Shape :
Rectangular, Fins
Thermal Resistance @ Forced Air Flow :
8.00°C/W @ 500 LFM
Thermal Resistance @ Natural :
18.00°C/W
Type :
Board Level, Vertical
Width :
1.000" (25.40mm)

Ähnliche Produkte