0C97055002

Beschreibung :
RFI EMI GROUNDING MATERIAL 25FT
Attachment Method :
Adhesive
Height :
0.030" (0.76mm)
Length :
24.000" (609.60mm)
Material :
Beryllium Copper
Operating Temperature :
121°C
Plating :
Unplated
Plating - Thickness :
-
Series :
Twist
Shape :
-
Type :
Fingerstock
Width :
0.230" (5.84mm)

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