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- Ausgewählte Bedingungen:
Entdecken Sie 557 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 25X406.4MM
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- | Beryllium Copper | 0.400" (10.16mm) | 24.000" (609.60mm) | 0.980" (24.89mm) | - | - | Clip | ||
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Laird Technologies EMI |
7
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3 tage |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 6.6X609.6MM
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- | Beryllium Copper | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.260" (6.60mm) | - | - | Snap-In | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 15.82X381MM
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- | Beryllium Copper | 0.220" (5.59mm) | 15.000" (381.00mm) | 0.620" (15.75mm) | Tin | 299.21μin (7.60μm) | Rivet | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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GASKET BECU 28.7X304.8MM
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- | Beryllium Copper | 0.410" (10.41mm) | 12.000" (304.80mm) | 1.130" (28.70mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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RFI EMI GROUNDING MATERIAL 25FT
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Twist | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | Unplated | - | Adhesive | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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RFI EMI GROUNDING MATERIAL 25FT
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Twist | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Unplated | - | Adhesive | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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RFI EMI GROUNDING MATERIAL 25FT
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Twist | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | Unplated | - | Adhesive | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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RFI EMI GROUNDING MATERIAL 25FT
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Large Enclosure | Beryllium Copper | 0.250" (6.35mm) | 25.000 (7.62m) | 1.090" (27.69mm) | - | - | Hardware，Rivet，Solder | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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RFI EMI GROUNDING MATERIAL 25FT
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- | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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RFI EMI GROUNDING MATERIAL 25FT
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- | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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RFI EMI GROUNDING MATERIAL 25FT
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- | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 12.7X609.6MM
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Twist | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.500" (12.70mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
53
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3 tage |
-
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MOQ: 1 MPQ: 1
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.140X.370 GASKET FABRIC O/ FOAM
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- | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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SLMT,2F,SNB,USFT
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Slot Mount | Beryllium Copper | 0.220" (5.59mm) | 0.532" (13.51mm) | 0.600" (15.24mm) | Tin | 299.21μin (7.60μm) | Slot | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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SLMT,1F,SNSAT
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Slot Mount | Beryllium Copper | 0.220" (5.59mm) | 0.250" (6.35mm) | 0.600" (15.24mm) | Tin | 299.21μin (7.60μm) | Slot | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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SLMT,1F,NID
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Slot Mount | Beryllium Copper | 0.220" (5.59mm) | 0.250" (6.35mm) | 0.600" (15.24mm) | Nickel | 299.21μin (7.60μm) | Slot | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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SLMT,1F,ZNC
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Slot Mount | Beryllium Copper | 0.220" (5.59mm) | 0.250" (6.35mm) | 0.600" (15.24mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Slot | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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SLMT,1F,ZNY
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Slot Mount | Beryllium Copper | 0.220" (5.59mm) | 0.250" (6.35mm) | 0.600" (15.24mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Slot | ||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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SLMT,1F,ZNC
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Slot Mount | Beryllium Copper | 0.110" (2.79mm) | 0.169" (4.29mm) | 0.320" (8.13mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Slot | ||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
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SLMT,1F,SNB
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Slot Mount | Beryllium Copper | 0.110" (2.79mm) | 0.169" (4.29mm) | 0.320" (8.13mm) | Tin | 299.21μin (7.60μm) | Slot |
