- Series：
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- Operating Temperature：
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- Shape：
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- Length：
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- Width：
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- Plating - Thickness：
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- Attachment Method：
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- Ausgewählte Bedingungen:
Entdecken Sie 53 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.25 X 0.78 BD 47.625 NTP--FOLDE
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 3.97 (1.21m) | 0.780" (19.81mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
.250"H X .375"W X 24"L--D SHAPED
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | D-Shape | 24.000" (609.60mm) | 0.375" (9.53mm) | - | - | - | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
|
CSTR COIL SNB
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Large Enclosure | 121°C | Fingerstock | Beryllium Copper | - | 25.000 (7.60m) | 1.090" (27.69mm) | Tin | 299.21μin (7.60μm) | Hardware，Rivet，Solder | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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CSTR COIL NIE
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Large Enclosure | 121°C | Fingerstock | Beryllium Copper | - | 25.000 (7.60m) | 1.090" (27.69mm) | Nickel | 299.21μin (7.60μm) | Hardware，Rivet，Solder | |||
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Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
CSTR COIL NIB
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Large Enclosure | 121°C | Fingerstock | Beryllium Copper | - | 25.000 (7.60m) | 1.090" (27.69mm) | Nickel | 299.21μin (7.60μm) | Hardware，Rivet，Solder | |||
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Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
.250"W X .250"H X 6.75"L--SQUARE
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | - | 6.750" (171.45mm) | 0.250" (6.35mm) | - | - | - | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,BF,USF,PSA
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- | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.780" (19.81mm) | - | - | Adhesive | |||
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Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
.250"X.500"X.125" COMBO W/ ADH--
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- | -75°C ~ 260°C | Gasket | - | Rectangular | - | 0.500" (12.70mm) | - | - | - | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
|
0.25 X 1.09 BD 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 1.090" (27.69mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
|
0.25 X 1.09 NI 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 1.090" (27.69mm) | Nickel | Flash | Adhesive | |||
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Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
0.25 X 0.78 BD 85.875 NTP--FOLDE
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 7.16 (2.18m) | 0.780" (19.81mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
.250"H X .375"W X 48"L--RECTANGU
|
- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Rectangular | 4.00 (1.22m) | 0.375" (9.53mm) | - | - | - | |||
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Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
0.25 X 1.09 X 070 BD 16--25-109C
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 1.090" (27.69mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
0.25 X 1.09 X 120 BD 16--25-109C
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 1.090" (27.69mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
0.25 X 1.09 X 130 BD 16--25-109C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 1.090" (27.69mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 0.78 X 0.50 BD 24--FOLDED
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.780" (19.81mm) | Unplated | - | Adhesive | |||
|
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Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 0.78 X 0.50 BD 24--FOLDED
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.780" (19.81mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 0.78 BD 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.780" (19.81mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 0.78 BD 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.780" (19.81mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 SN 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 1.090" (27.69mm) | Tin | Flash | Adhesive |
