Kontakte, Fingerstock und Dichtungen - Zui Ai Technology（Taiwan）Company.

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Bild	Teilenummer	Hersteller	Menge	Lieferfrist	Stückpreis	Kaufen	Beschreibung	Height	Width	Plating	Plating - Thickness
Bild	Teilenummer	Hersteller	Menge	Lieferfrist	Stückpreis	Kaufen	Beschreibung	Height	Width	Plating	Plating - Thickness
	97055002	Laird Technologies EMI	546	3 tage	-	FINGERSTOCK BECU ALLOY 6X609.6MM MOQ: 1 MPQ: 1	FINGERSTOCK BECU ALLOY 6X609.6MM	0.030" (0.76mm)	0.230" (5.84mm)	-	-
	97055102	Laird Technologies EMI	159	3 tage	-	FINGERSTOCK BECU 4X609.6MM MOQ: 1 MPQ: 1	FINGERSTOCK BECU 4X609.6MM	0.030" (0.76mm)	0.160" (4.06mm)	-	-
	97056902	Laird Technologies EMI	134	3 tage	-	FINGERSTOCK BECU 12.7X609.6MM MOQ: 1 MPQ: 1	FINGERSTOCK BECU 12.7X609.6MM	0.120" (3.05mm)	0.500" (12.70mm)	-	-
	97055517	Laird Technologies EMI	162	3 tage	-	FINGERSTOCK BECU 8.64X609.6MM MOQ: 1 MPQ: 1	FINGERSTOCK BECU 8.64X609.6MM	0.070" (1.78mm)	0.340" (8.64mm)	Zinc + Clear Chromate	299.21μin (7.60μm)
	97055802	Laird Technologies EMI	60	3 tage	-	FINGERSTOCK BECU 2.79X609.6MM MOQ: 1 MPQ: 1	FINGERSTOCK BECU 2.79X609.6MM	0.070" (1.78mm)	0.200" (5.08mm)	-	-
	0C97055002	Laird Technologies EMI	79	3 tage	-	RFI EMI GROUNDING MATERIAL 25FT MOQ: 1 MPQ: 1	RFI EMI GROUNDING MATERIAL 25FT	0.030" (0.76mm)	0.230" (5.84mm)	Unplated	-
	97055117	Laird Technologies EMI	33	3 tage	-	FINGERSTOCK BECU 4X609.6MM MOQ: 1 MPQ: 1	FINGERSTOCK BECU 4X609.6MM	0.030" (0.76mm)	0.160" (4.06mm)	Tin	299.21μin (7.60μm)
	97055602	Laird Technologies EMI	63	3 tage	-	FINGERSTOCK BECU 8.64X609.6MM MOQ: 1 MPQ: 1	FINGERSTOCK BECU 8.64X609.6MM	0.070" (1.78mm)	0.340" (8.64mm)	-	-
	97055902	Laird Technologies EMI	22	3 tage	-	FINGRSTOCK BECU ALY 7.57X609.6MM MOQ: 1 MPQ: 1	FINGRSTOCK BECU ALY 7.57X609.6MM	0.070" (1.78mm)	0.300" (7.62mm)	-	-
	97056002	Laird Technologies EMI	Anfrage	-	-	FINGERSTOCK BECU 12.7X609.6MM MOQ: 1 MPQ: 1	FINGERSTOCK BECU 12.7X609.6MM	0.070" (1.78mm)	0.500" (12.70mm)	-	-
	97056702	Laird Technologies EMI	Anfrage	-	-	FINGERSTOCK BECU 18.29X609.6MM MOQ: 1 MPQ: 1	FINGERSTOCK BECU 18.29X609.6MM	0.209" (5.31mm)	0.725" (18.42mm)	-	-
	97055502	Laird Technologies EMI	Anfrage	-	-	FINGRSTOCK BECU ALY 8.64X609.6MM MOQ: 1 MPQ: 1	FINGRSTOCK BECU ALY 8.64X609.6MM	0.030" (0.76mm)	0.230" (5.84mm)	-	-
	0C97055902	Laird Technologies EMI	Anfrage	-	-	RFI EMI GROUNDING MATERIAL 25FT MOQ: 1 MPQ: 1	RFI EMI GROUNDING MATERIAL 25FT	0.070" (1.78mm)	0.300" (7.62mm)	Unplated	-
	0C97055502	Laird Technologies EMI	Anfrage	-	-	RFI EMI GROUNDING MATERIAL 25FT MOQ: 1 MPQ: 1	RFI EMI GROUNDING MATERIAL 25FT	0.070" (1.78mm)	0.340" (8.64mm)	Unplated	-
	0C98055902	Laird Technologies EMI	Anfrage	-	-	RFI EMI GROUNDING MATERIAL 25FT MOQ: 1 MPQ: 1	RFI EMI GROUNDING MATERIAL 25FT	0.070" (1.78mm)	0.300" (7.62mm)	Unplated	-
	97056102	Laird Technologies EMI	Anfrage	-	-	FINGERSTOCK BECU 12.7X609.6MM MOQ: 1 MPQ: 1	FINGERSTOCK BECU 12.7X609.6MM	0.070" (1.78mm)	0.500" (12.70mm)	-	-
	0C98055002	Laird Technologies EMI	Anfrage	-	-	TWT COIL BF USF PSA MOQ: 1 MPQ: 1	TWT COIL BF USF PSA	0.030" (0.76mm)	0.230" (5.84mm)	Unplated	-
	0C97055016	Laird Technologies EMI	Anfrage	-	-	TWT COIL ZNY PSA MOQ: 1 MPQ: 1	TWT COIL ZNY PSA	0.030" (0.76mm)	0.230" (5.84mm)	Zinc + Yellow Chromate	299.21μin (7.60μm)
	0C98055019	Laird Technologies EMI	Anfrage	-	-	TWT COIL NIB USF PSA MOQ: 1 MPQ: 1	TWT COIL NIB USF PSA	0.030" (0.76mm)	0.230" (5.84mm)	Tin	299.21μin (7.60μm)
	0C97056915	Laird Technologies EMI	Anfrage	-	-	TWT COIL ZNC PSA MOQ: 1 MPQ: 1	TWT COIL ZNC PSA	0.120" (3.05mm)	0.500" (12.70mm)	Zinc + Clear Chromate	299.21μin (7.60μm)