- Series：
-
- Type：
-
- Material：
-
- Width：
-
- Plating - Thickness：
-
- Attachment Method：
-
- Ausgewählte Bedingungen:
Entdecken Sie 9 -Produkte
 |
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
Large Enclosure | 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 1.090" (27.69mm) | - | - | Hardware，Rivet，Solder | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
PCBS COIL BF
|
- | - | - | - | - | 0.827" (21.00mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL SNB PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | 0.250" (6.35mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL SNB
|
Large Enclosure | 121°C | Fingerstock | Beryllium Copper | 0.410" (10.41mm) | 1.630" (41.40mm) | Tin | 299.21μin (7.60μm) | Hardware，Rivet，Solder | ||
|
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
PCBS COIL BF
|
- | - | - | - | - | 0.520" (13.20mm) | - | - | - | ||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
PCBS COIL SNSAT
|
- | - | - | - | - | 0.827" (21.00mm) | - | - | - | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL NIE
|
Large Enclosure | 121°C | Fingerstock | Beryllium Copper | 0.410" (10.41mm) | 1.630" (41.40mm) | Nickel | 299.21μin (7.60μm) | Hardware，Rivet，Solder | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL BF USF
|
Large Enclosure | 121°C | Fingerstock | Beryllium Copper | 0.410" (10.41mm) | 1.630" (41.40mm) | Unplated | - | Adhesive | |||
|
|
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL ZNY
|
Large Enclosure | 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 1.090" (27.69mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Hardware，Rivet，Solder |
