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- Operating Temperature：
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- Type：
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- Height：
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- Plating：
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- Ausgewählte Bedingungen:
Entdecken Sie 1,795 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Leader Tech Inc. |
Anfrage
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-
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MOQ: 1 MPQ: 1
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1.50" X 50 LONG TECHMESH TAPE--
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- | - | Gasket Sleeve | - | - | - | 1.500" (38.10mm) | Tin | - | - | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.06 X 0.50 BD 300--TWIST DOUBLE
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.060" (1.52mm) | 25.00 (7.62m) | 0.500" (12.70mm) | Unplated | - | Adhesive | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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CSTR,FRG,BF
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- | - | - | - | - | - | - | - | - | - | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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CSTR,FRG,NIB
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- | - | - | - | - | - | - | - | - | - | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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AP,STR,SNB,RA,CM
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- | - | - | - | - | - | - | - | - | - | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.25 X 1.09 SU 300"--FOLDED SERI
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 25.00 (7.62m) | 1.090" (27.69mm) | Unplated | - | Adhesive | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,SNB,RA,CM
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- | - | - | - | - | - | - | - | - | - | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.07 X 0.13 AU 12--7-13U-AU-12--
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 12.000" (304.80mm) | 0.130" (3.30mm) | Gold | Flash | Adhesive | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
|
2.25" X 50 LONG TECHMESH TAPE--
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- | - | Gasket Sleeve | - | - | - | 2.250" (57.15mm) | Tin | - | - | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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OBSTK,94603001 REV F
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- | - | - | - | - | - | - | - | - | - | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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CSTR,STR,BF,USFT
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- | - | - | - | - | - | - | - | - | - | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.09 X 0.19 AU 16--9-19UD-AU-16-
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.090" (2.29mm) | 16.000" (406.40mm) | 0.190" (4.83mm) | Gold | Flash | Adhesive | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.05 X 0.53 AU 16--4-53D-AU-16--
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.050" (1.28mm) | 16.000" (406.40mm) | 0.530" (13.46mm) | Gold | Flash | Adhesive | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
|
.500" X 50 LONG TECHMESH TAPE--
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- | - | Gasket Sleeve | - | - | - | 0.500" (12.70mm) | Tin | - | - | |||
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Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
0.11 X 0.26 AU 16--10-26UD-AU-16
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TechMESH | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.260" (6.60mm) | Gold | Flash | Adhesive | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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GK NICU NRS PU NR REC
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- | - | - | - | - | - | - | - | - | - | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.11 X 0.32 AU 16--11-S-32AH-AU-
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Gold | Flash | Adhesive | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.14 X 0.36 BD 300"--FOLDED SERI
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 25.00 (7.62m) | 0.370" (9.40mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
|
0.03 X 0.08 SN 300--TWIST RIGHT
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.030" (0.76mm) | 25.00 (7.62m) | 0.080" (2.03mm) | Tin | Flash | Adhesive | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
|
0.07 X 0.34 BD 300--6-34T-BD-300
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 25.00 (7.62m) | 0.340" (8.64mm) | Unplated | - | Adhesive |
