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- Operating Temperature：
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- Type：
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- Material：
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- Height：
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- Length：
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- Plating：
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- Plating - Thickness：
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- Ausgewählte Bedingungen:
Entdecken Sie 1,795 -Produkte
 |
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Harwin Inc. |
2,087
|
3 tage |
-
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MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER GOLD SMD
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- | - | Shield Finger | - | 0.285" (7.25mm) | 0.378" (9.60mm) | 0.225" (5.70mm) | Gold | Flash | Solder | ||
|
|
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Harwin Inc. |
2,087
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER GOLD SMD
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- | - | Shield Finger | - | 0.285" (7.25mm) | 0.378" (9.60mm) | 0.225" (5.70mm) | Gold | Flash | Solder | ||
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Laird Technologies EMI |
25,564
|
3 tage |
-
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MOQ: 1 MPQ: 1
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GASKET BECU 8.1X4.27MM
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Slot Mount | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 0.169" (4.29mm) | 0.320" (8.13mm) | - | - | Slot | ||
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|
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Wurth Electronics Inc. |
2,000
|
3 tage |
-
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MOQ: 1 MPQ: 1
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CONTACT FINGER EMI SMD
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WE-SECF | -40°C ~ 100°C | Shield Finger，Pre-Loaded | Beryllium Copper | 0.157" (4.00mm) | 0.177" (4.50mm) | 0.118" (3.00mm) | Gold | Flash | Solder | ||
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|
|
Wurth Electronics Inc. |
3,067
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger，Pre-Loaded | Beryllium Copper | 0.157" (4.00mm) | 0.177" (4.50mm) | 0.118" (3.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
3,067
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger，Pre-Loaded | Beryllium Copper | 0.157" (4.00mm) | 0.177" (4.50mm) | 0.118" (3.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
4,800
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.276" (7.00mm) | 0.244" (6.20mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
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|
|
Wurth Electronics Inc. |
5,349
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.276" (7.00mm) | 0.244" (6.20mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
5,349
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.276" (7.00mm) | 0.244" (6.20mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Laird Technologies EMI |
2,273
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
CARD GUI CLIPON BECU 2.03X9.53MM
|
- | 121°C | Fingerstock | Beryllium Copper | 0.062" (1.57mm) | 0.375" (9.53mm) | 0.084" (2.13mm) | - | - | Clip | ||
|
|
|
Laird Technologies EMI |
2,397
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 15.88X11.35MM
|
- | - | - | - | - | 0.447" (11.35mm) | 0.625" (15.88mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
830
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU ALLOY 8.1X609.6MM
|
No Snag | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 24.000" (609.60mm) | 0.320" (8.13mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
114
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 9.4X406.40MM
|
No Snag | 121°C | Fingerstock | Beryllium Copper | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | ||
|
|
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Laird Technologies EMI |
205
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTCK BECU ALY 5.33X609.6MM
|
- | 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.210" (5.33mm) | - | - | Clip | ||
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|
|
Laird Technologies EMI |
219
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 8.1X406.4MM
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No Snag | 121°C | Fingerstock | Beryllium Copper | 0.100" (2.54mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
359
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 27.94X609.6MM
|
No Snag | 121°C | Fingerstock | Beryllium Copper | 0.400" (10.16mm) | 24.000" (609.60mm) | 1.100" (27.94mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
447
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU ALLOY 15.24X609.6MM
|
No Snag | 121°C | Fingerstock | Beryllium Copper | 0.220" (5.59mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
527
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU ALLOY 11.43X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.450" (11.43mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
128
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 11.43X411.48MM
|
- | 121°C | Fingerstock | Beryllium Copper | 0.122" (3.10mm) | 16.200" (411.48mm) | 0.450" (11.43mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
157
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 3.18X304.8MM
|
- | - | - | - | - | 12.000" (304.80mm) | 0.125" (3.18mm) | - | - | - |
