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- Operating Temperature：
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- Height：
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- Plating：
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- Ausgewählte Bedingungen:
Entdecken Sie 1,795 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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.062" H X 3.0" L W/ADHESIVE--810
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- | -62°C ~ 260°C | Gasket | Conductive Elastomer | - | - | - | - | - | - | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.11 X 0.28 X 0.23 NI 16--FOLDED
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | Flash | Adhesive | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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NOSG COIL ZNY PSA
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Foldover | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Adhesive | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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NOSG COIL NIB PSA
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Foldover | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Nickel | 299.21μin (7.60μm) | Adhesive | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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CSTR,STR,BF
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- | - | - | - | - | - | - | - | - | - | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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AP,STR,BF,USF,PSA
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- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | - | - | Adhesive | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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GK NICU NRS PU V0 REC
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- | - | - | - | - | - | - | - | - | - | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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AP COIL SNB PSA
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All-Purpose | 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.11 X 0.32 NI 16--11-32AF-NI-16
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Nickel | Flash | Adhesive | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.11 X 0.32 NI 16--11-32RH-NI-16
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Nickel | Flash | Adhesive | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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NOSG,STR,BF,USFT,PSA
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Foldover | 121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | - | - | Adhesive | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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S3,STR,SNB,USFT,RIV
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- | 121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
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Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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0.11 X 0.28 NI 16 NTP--FOLDED SE
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | Flash | Adhesive | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
|
CSTR,STR,BF,USFT
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- | - | - | - | - | - | - | - | - | - | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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S3,STR,ZNC,USFT,PSA
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- | 121°C | Fingerstock | Beryllium Copper | 0.220" (5.59mm) | 15.000" (381.00mm) | 0.620" (15.75mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,BF,USF,PSA
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- | 121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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AP COIL BF USFT PSA
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All-Purpose | 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Unplated | - | Adhesive | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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STS3,STR,ZNY,USFT
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- | 121°C | Fingerstock | Beryllium Copper | 0.220" (5.59mm) | 15.000" (381.00mm) | 0.620" (15.75mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Adhesive | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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CSTR,STR,BF,PSA
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- | - | - | - | - | - | - | - | - | - | |||
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Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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PCLIP,STR,BF,USFT,CLO
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- | 121°C | Fingerstock | Beryllium Copper | 0.305" (7.75mm) | 11.945" (303.40mm) | - | - | - | Clip |
