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Entdecken Sie 1,795 -Produkte
Bild Teilenummer Hersteller Menge Lieferfrist Stückpreis Kaufen Beschreibung Series Operating Temperature Type Material Height Length Width Plating Plating - Thickness Attachment Method
97022117
Laird Technologies EMI
Anfrage
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-
MOQ: 1  MPQ: 1
CSTR,STR,SNB
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SG250250SV-6.75
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
.250"W X .250"H X 6.75"L--SQUARE
- -40°C ~ 70°C Fabric Over Foam Polyurethane Foam,Nickel-Copper Polyester (NI/CU) 0.250" (6.35mm) 6.750" (171.45mm) 0.250" (6.35mm) - - -
4351EK51Y00984
Laird Technologies EMI
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MOQ: 1  MPQ: 1
IO NICU MESH PU V0 REC
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97022132
Laird Technologies EMI
Anfrage
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MOQ: 1  MPQ: 1
CSTR,STR,BF,PSA
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98022117
Laird Technologies EMI
Anfrage
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MOQ: 1  MPQ: 1
CSTR,STR,SNB,USFT
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0C97086608
Laird Technologies EMI
Anfrage
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MOQ: 1  MPQ: 1
PCBS COIL SNSAT
- - - - - 25.000 (7.62m) 0.827" (21.00mm) - - -
98050002
Laird Technologies EMI
Anfrage
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MOQ: 1  MPQ: 1
AP,COIL,BF,USFT,PSA
- 121°C Fingerstock Beryllium Copper 0.230" (5.84mm) 24.000" (609.60mm) 0.600" (15.24mm) - - Adhesive
13-S-37AH-ST-16
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.13 X 0.37 ST 16.0--13-S-37AH-S
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.130" (3.30mm) 16.000" (406.40mm) 0.370" (9.40mm) Tin Flash Adhesive
11-28RH-BD-16
Leader Tech Inc.
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MOQ: 1  MPQ: 1
0.11 X 0.28 BD 16--11-28RH-BD-16
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Unplated - Adhesive
11-32AF-BD-16
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.11 X 0.32 BD 16--11-32AF-BD-16
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.110" (2.79mm) 16.000" (406.40mm) 0.320" (8.13mm) Unplated - Adhesive
11-32RH-BD-16
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.11 X 0.32 BD 16--11-32RH-BD-16
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.110" (2.79mm) 16.000" (406.40mm) 0.320" (8.13mm) Unplated - Adhesive
23-60FS-BD-3.0
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.23 X 0.60 BD 3--FOLDED SERIES
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.230" (5.84mm) 3.000" (76.20mm) 0.600" (15.24mm) Unplated - Adhesive
98091802
Laird Technologies EMI
Anfrage
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MOQ: 1  MPQ: 1
S3,STR,BF,USFT,PSA
- 121°C Fingerstock Beryllium Copper 0.110" (2.79mm) 15.000" (381.00mm) 0.350" (8.89mm) - - Adhesive
98095702
Laird Technologies EMI
Anfrage
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MOQ: 1  MPQ: 1
S3,STR,BF,USF,PSA
- 121°C Fingerstock Beryllium Copper 0.110" (2.79mm) 15.000" (381.00mm) 0.350" (8.89mm) - - Adhesive
97030002
Laird Technologies EMI
Anfrage
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MOQ: 1  MPQ: 1
CSTR,STR,BF
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97031021
Laird Technologies EMI
Anfrage
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MOQ: 1  MPQ: 1
CSTR,STR,SU
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97032019
Laird Technologies EMI
Anfrage
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MOQ: 1  MPQ: 1
CSTR,STR,NIB
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869004109
Laird Technologies EMI
Anfrage
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MOQ: 1  MPQ: 1
CSTR,STR,SNSAT,CM
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11-32AH-SS-17.76
Leader Tech Inc.
Anfrage
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MOQ: 1  MPQ: 1
0.11 X 0.32 SS 17.76--11-32AH-SS
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.110" (2.79mm) 17.760" (451.10mm) 0.320" (8.13mm) - - Adhesive
97022302
Laird Technologies EMI
Anfrage
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MOQ: 1  MPQ: 1
CSTR,STR,BF
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