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- Plating:
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- Ausgewählte Bedingungen:
Entdecken Sie 1,795 -Produkte
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
Laird Technologies EMI |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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CSTR,STR,SNB
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- | - | - | - | - | - | - | - | - | - | ||||
Leader Tech Inc. |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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.250"W X .250"H X 6.75"L--SQUARE
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam,Nickel-Copper Polyester (NI/CU) | 0.250" (6.35mm) | 6.750" (171.45mm) | 0.250" (6.35mm) | - | - | - | ||||
Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
IO NICU MESH PU V0 REC
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- | - | - | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
CSTR,STR,BF,PSA
|
- | - | - | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
CSTR,STR,SNB,USFT
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- | - | - | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
PCBS COIL SNSAT
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- | - | - | - | - | 25.000 (7.62m) | 0.827" (21.00mm) | - | - | - | ||||
Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,COIL,BF,USFT,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | - | - | Adhesive | ||||
Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
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0.13 X 0.37 ST 16.0--13-S-37AH-S
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | Flash | Adhesive | ||||
Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
0.11 X 0.28 BD 16--11-28RH-BD-16
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
0.11 X 0.32 BD 16--11-32AF-BD-16
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
0.11 X 0.32 BD 16--11-32RH-BD-16
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
0.23 X 0.60 BD 3--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | 3.000" (76.20mm) | 0.600" (15.24mm) | Unplated | - | Adhesive | ||||
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,BF,USFT,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,BF,USF,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR,STR,BF
|
- | - | - | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
CSTR,STR,SU
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- | - | - | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
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CSTR,STR,NIB
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- | - | - | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
CSTR,STR,SNSAT,CM
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- | - | - | - | - | - | - | - | - | - | ||||
Leader Tech Inc. |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
0.11 X 0.32 SS 17.76--11-32AH-SS
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 17.760" (451.10mm) | 0.320" (8.13mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
CSTR,STR,BF
|
- | - | - | - | - | - | - | - | - | - |