- Series：
-
- Operating Temperature：
-
- Type：
-
- Material：
-
- Height：
-
- Length：
-
- Width：
-
- Plating：
-
- Plating - Thickness：
-
- Ausgewählte Bedingungen:
Entdecken Sie 1,795 -Produkte
 |
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Laird Technologies EMI |
259
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 15.82X381MM
|
- | 121°C | Fingerstock | Beryllium Copper | 0.220" (5.59mm) | 15.000" (381.00mm) | 0.620" (15.75mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
143
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 27.69X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.210" (5.33mm) | - | - | Clip | ||
|
|
|
Laird Technologies EMI |
106
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 19.3X609.6MM
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
162
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 8.64X609.6MM
|
Twist | 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
333
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 1.7X304.8MM
|
- | - | - | - | - | 12.000" (304.80mm) | 0.067" (1.70mm) | - | - | - | ||
|
|
|
Wurth Electronics Inc. |
135
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
CONDUCTIVE NI/CU GLASS SLEEVE 1M
|
WE-ST | -60°C ~ 160°C | Gasket Sleeve | Nickel-Copper (NI/CU) Glass Fiber | - | 39.370" (1.00m) | 0.472" (12.00mm) | - | - | - | ||
|
|
|
Molex Connector Corporation |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.30MM - 0.55MM H
|
105384 | - | Shield Finger，Pre-Loaded | Stainless Steel | 0.055" (1.40mm) | 0.154" (3.90mm) | 0.087" (2.20mm) | Gold | 19.7μin (0.50μm) | Solder | ||
|
|
|
Molex Connector Corporation |
6,551
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.30MM - 0.55MM H
|
105384 | - | Shield Finger，Pre-Loaded | Stainless Steel | 0.055" (1.40mm) | 0.154" (3.90mm) | 0.087" (2.20mm) | Gold | 19.7μin (0.50μm) | Solder | ||
|
|
|
Molex Connector Corporation |
6,551
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.30MM - 0.55MM H
|
105384 | - | Shield Finger，Pre-Loaded | Stainless Steel | 0.055" (1.40mm) | 0.154" (3.90mm) | 0.087" (2.20mm) | Gold | 19.7μin (0.50μm) | Solder | ||
|
|
|
Molex，LLC |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.40MM - 0.80MM H
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | 0.043" (1.10mm) | 0.154" (3.90mm) | 0.079" (2.00mm) | Gold | 19.685μin (0.50μm) | Solder | ||
|
|
|
Molex，LLC |
6,926
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.40MM - 0.80MM H
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | 0.043" (1.10mm) | 0.154" (3.90mm) | 0.079" (2.00mm) | Gold | 19.685μin (0.50μm) | Solder | ||
|
|
|
Molex，LLC |
6,926
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.40MM - 0.80MM H
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | 0.043" (1.10mm) | 0.154" (3.90mm) | 0.079" (2.00mm) | Gold | 19.685μin (0.50μm) | Solder | ||
|
|
|
Harwin Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
- | -40°C ~ 85°C | Shield Clip | Stainless Steel | 0.039" (1.00mm) | 0.154" (3.90mm) | 0.043" (1.10mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
14,627
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
- | -40°C ~ 85°C | Shield Clip | Stainless Steel | 0.039" (1.00mm) | 0.154" (3.90mm) | 0.043" (1.10mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
14,627
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
- | -40°C ~ 85°C | Shield Clip | Stainless Steel | 0.039" (1.00mm) | 0.154" (3.90mm) | 0.043" (1.10mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
EZ BoardWare | -40°C ~ 125°C | Shield Clip | Stainless Steel | 0.088" (2.23mm) | 0.207" (5.25mm) | 0.042" (1.07mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
1,817
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
EZ BoardWare | -40°C ~ 125°C | Shield Clip | Stainless Steel | 0.088" (2.23mm) | 0.207" (5.25mm) | 0.042" (1.07mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
1,817
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
EZ BoardWare | -40°C ~ 125°C | Shield Clip | Stainless Steel | 0.088" (2.23mm) | 0.207" (5.25mm) | 0.042" (1.07mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Wurth Electronics Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.059" (1.50mm) | 0.126" (3.20mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
6,720
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.059" (1.50mm) | 0.126" (3.20mm) | 0.059" (1.50mm) | Gold | Flash | Solder |
