- Series：
-
- Operating Temperature：
-
- Type：
-
- Material：
-
- Height：
-
- Length：
-
- Width：
-
- Plating：
-
- Plating - Thickness：
-
- Ausgewählte Bedingungen:
Entdecken Sie 1,795 -Produkte
 |
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Harwin Inc. |
12,000
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | 0.079" (2.00mm) | 0.181" (4.60mm) | 0.110" (2.80mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
13,779
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | 0.079" (2.00mm) | 0.181" (4.60mm) | 0.110" (2.80mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
13,779
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | 0.079" (2.00mm) | 0.181" (4.60mm) | 0.110" (2.80mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
8,000
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.3MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | 0.051" (1.30mm) | 0.118" (3.00mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
8,394
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.3MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | 0.051" (1.30mm) | 0.118" (3.00mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
8,394
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.3MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | 0.051" (1.30mm) | 0.118" (3.00mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
2,500
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.75MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | 0.108" (2.75mm) | 0.246" (6.25mm) | 0.125" (3.18mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
3,537
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.75MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | 0.108" (2.75mm) | 0.246" (6.25mm) | 0.125" (3.18mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
3,537
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.75MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | 0.108" (2.75mm) | 0.246" (6.25mm) | 0.125" (3.18mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
3,800
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP TIN SMD
|
EZ BoardWare | -40°C ~ 125°C | Shield Clip | Stainless Steel | 0.140" (3.55mm) | 0.346" (8.79mm) | 0.090" (2.28mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
4,381
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP TIN SMD
|
EZ BoardWare | -40°C ~ 125°C | Shield Clip | Stainless Steel | 0.140" (3.55mm) | 0.346" (8.79mm) | 0.090" (2.28mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
4,381
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP TIN SMD
|
EZ BoardWare | -40°C ~ 125°C | Shield Clip | Stainless Steel | 0.140" (3.55mm) | 0.346" (8.79mm) | 0.090" (2.28mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Laird Technologies EMI |
6,000
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 3.1X2.5MM
|
- | - | - | - | - | - | - | - | - | - | ||
|
|
|
Laird Technologies EMI |
11,004
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 3.1X2.5MM
|
- | - | - | - | - | - | - | - | - | - | ||
|
|
|
Laird Technologies EMI |
11,004
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 3.1X2.5MM
|
- | - | - | - | - | - | - | - | - | - | ||
|
|
|
Wurth Electronics Inc. |
4,500
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.224" (5.70mm) | 0.185" (4.70mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
4,584
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.224" (5.70mm) | 0.185" (4.70mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
4,584
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.224" (5.70mm) | 0.185" (4.70mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,500
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.209" (5.30mm) | 0.157" (4.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,637
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.209" (5.30mm) | 0.157" (4.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder |
