- Operating Temperature：
-
- Package / Case：
-
- Supplier Device Package：
-
- Primary Attributes：
-
- Ausgewählte Bedingungen:
Entdecken Sie 12 -Produkte
 |
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Operating Temperature | Package / Case | Supplier Device Package | Primary Attributes | RAM Size | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Operating Temperature | Package / Case | Supplier Device Package | Primary Attributes | RAM Size | |
|
|
|
Xilinx Inc. |
60
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
XAZU2EG-1SFVA625I
|
-40°C ~ 100°C (TJ) | 625-BFBGA，FCBGA | 625-FCBGA (21x21) | Zynq®UltraScale+® FPGA，103K+ Logic Cells | 1.2MB | ||
|
|
|
Xilinx Inc. |
60
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
XAZU2EG-1SFVC784I
|
-40°C ~ 100°C (TJ) | 784-BFBGA，FCBGA | 784-FCBGA (23x23) | Zynq®UltraScale+® FPGA，103K+ Logic Cells | 1.2MB | ||
|
|
|
Xilinx Inc. |
60
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
XAZU2EG-L1SFVA625I
|
-40°C ~ 100°C (TJ) | 625-BFBGA，FCBGA | 625-FCBGA (21x21) | Zynq®UltraScale+® FPGA，103K+ Logic Cells | 1.2MB | ||
|
|
|
Xilinx Inc. |
60
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
XAZU2EG-L1SFVC784I
|
-40°C ~ 100°C (TJ) | 784-BFBGA，FCBGA | 784-FCBGA (23x23) | Zynq®UltraScale+® FPGA，154K+ Logic Cells | 1.2MB | ||
|
|
|
Xilinx Inc. |
60
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
XAZU3EG-1SFVA625I
|
-40°C ~ 100°C (TJ) | 625-BFBGA，FCBGA | 625-FCBGA (21x21) | Zynq®UltraScale+® FPGA，154K+ Logic Cells | 1.8MB | ||
|
|
|
Xilinx Inc. |
60
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
XAZU3EG-1SFVC784I
|
-40°C ~ 100°C (TJ) | 784-BFBGA，FCBGA | 784-FCBGA (23x23) | Zynq®UltraScale+® FPGA，154K+ Logic Cells | 1.8MB | ||
|
|
|
Xilinx Inc. |
60
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
XAZU3EG-L1SFVA625I
|
-40°C ~ 100°C (TJ) | 625-BFBGA，FCBGA | 625-FCBGA (21x21) | Zynq®UltraScale+® FPGA，154K+ Logic Cells | 1.8MB | ||
|
|
|
Xilinx Inc. |
60
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
XAZU3EG-L1SFVC784I
|
-40°C ~ 100°C (TJ) | 784-BFBGA，FCBGA | 784-FCBGA (23x23) | Zynq®UltraScale+® FPGA，154K+ Logic Cells | 1.8MB | ||
|
|
|
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
XAZU2EG-1SFVA625Q
|
-40°C ~ 125°C (TJ) | 625-BFBGA，FCBGA | 625-FCBGA (21x21) | Zynq®UltraScale+® FPGA，103K+ Logic Cells | 1.2MB | ||
|
|
|
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
XAZU2EG-1SFVC784Q
|
-40°C ~ 125°C (TJ) | 784-BFBGA，FCBGA | 784-FCBGA (23x23) | Zynq®UltraScale+® FPGA，103K+ Logic Cells | 1.2MB | ||
|
|
|
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
XAZU3EG-1SFVA625Q
|
-40°C ~ 125°C (TJ) | 625-BFBGA，FCBGA | 625-FCBGA (21x21) | Zynq®UltraScale+® FPGA，154K+ Logic Cells | 1.8MB | ||
|
|
|
Xilinx Inc. |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
XAZU3EG-1SFVC784Q
|
-40°C ~ 125°C (TJ) | 784-BFBGA，FCBGA | 784-FCBGA (23x23) | Zynq®UltraScale+® FPGA，154K+ Logic Cells | 1.8MB |
