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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Ausgewählte Bedingungen:
Entdecken Sie 429 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Aluminum | Cylindrical | - | - | 0.315" (8.00mm) ID, 1.250" (31.75mm) OD | Press Fit | TO-5 | 0.400" (10.16mm) | 1.8W @ 50°C | 14.00°C/W @ 200 LFM | 21.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Aluminum | Square | 0.790" (20.07mm) | 0.790" (20.07mm) | - | Thermal Tape, Adhesive (Not Included) | BGA | 0.155" (3.94mm) | 1.0W @ 40°C | 20.00°C/W @ 200 LFM | - | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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THERMAL LINK
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- | - | - | - | - | - | - | - | - | - | - | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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Board Level | Aluminum | Square, Fins | 0.655" (16.64mm) | 0.655" (16.64mm) | - | Thermal Tape, Adhesive (Not Included) | BGA | 0.265" (6.73mm) | 1.0W @ 40°C | 17.50°C/W @ 300 LFM | - | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK
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- | - | - | - | - | - | - | - | - | - | - | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
4
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3 tage |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 W/SHURLOCK-CLIP
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- | - | - | - | - | - | - | - | - | - | - | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK
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- | - | - | - | - | - | - | - | - | - | - | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK
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- | - | - | - | - | - | - | - | - | - | - | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK BAR
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- | - | - | - | - | - | - | - | - | - | - | - | - |
