2286B

Beschreibung :
BOARD LEVEL HEAT SINK
Attachment Method :
Thermal Tape, Adhesive (Not Included)
Diameter :
-
Height Off Base (Height of Fin) :
0.155" (3.94mm)
Length :
0.790" (20.07mm)
Material :
Aluminum
Material Finish :
Black Anodized
Package Cooled :
BGA
Power Dissipation @ Temperature Rise :
1.0W @ 40°C
Series :
-
Shape :
Square
Thermal Resistance @ Forced Air Flow :
20.00°C/W @ 200 LFM
Thermal Resistance @ Natural :
-
Type :
Board Level
Width :
0.790" (20.07mm)

Ähnliche Produkte