Xilinx Inc.

XA3S1200E-4FTG256Q

Beschreibung :
IC FPGA 190 I/O 256FTBGA
Paket :
256-FTBGA (17x17)
Mounting Type :
Surface Mount
Number of Gates :
1200000
Number of I/O :
190
Number of LABs/CLBs :
8672
Number of Logic Elements/Cells :
19512
Operating Temperature :
-40°C ~ 125°C (TJ)
Package / Case :
256-LBGA
Series :
Automotive,AEC-Q100,Spartan-3E XA
Supplier Device Package :
256-FTBGA (17x17)
Total RAM Bits :
516096
Voltage - Supply :
1.14 V ~ 1.26 V

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