APF19-19-06CB

Beschreibung :
HEATSINK LOW-PROFILE FORGED
Attachment Method :
Thermal Tape, Adhesive (Not Included)
Diameter :
-
Height Off Base (Height of Fin) :
0.250" (6.35mm)
Length :
0.748" (19.00mm)
Material :
Aluminum
Material Finish :
Black Anodized
Package Cooled :
Assorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise :
-
Series :
APF
Shape :
Square, Fins
Thermal Resistance @ Forced Air Flow :
7.10°C/W @ 200 LFM
Thermal Resistance @ Natural :
-
Type :
Top Mount
Width :
0.748" (19.00mm)

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