HSP-2

Beschreibung :
THERMAL PAD SNGL PHASE WADHESVE
Adhesive :
Adhesive - One Side
Backing,Carrier :
-
Color :
Black
Material :
-
Outline :
57.15mm x 44.45mm
Series :
HSP
Shape :
Rectangle
Thermal Conductivity :
2.0 W/m-K
Thermal Resistivity :
-
Thickness :
0.0050" (0.127mm)
Usage :
Single Phase SSRs,M50 Power Modules

Ähnliche Produkte